Preparation method of ultrathin and ultra-flexible graphene conductive film

Abstract

The invention discloses a preparation method of an ultrathin and ultra-flexible graphene conductive film, which comprises the following steps of: 1) attaching a graphene surface of a graphene / metal foil grown through a CVD method to a glue-containing film together, and forming a structure of glue-containing film / graphene / metal foil; 2) removing a metal foil, and forming a structure of glue-containing film / graphene; 3) drying the glue-containing film / grapheme from the step 2); 4) combining an ultrathin and ultra-flexible object substrate with a back film, performing cutting and preshrinking processes, and forming the ultrathin and ultra-flexible object substrate supported by the back film; 5) transferring the graphene of the dried glue-containing film / graphene from the step 3) to the ultrathin and ultra-flexible object substrate supported by the back film from the step 4), and forming a glue-containing film / graphene / ultrathin substrate / back film; and 6) removing the glue-containing film and the back film, and obtaining a graphene / ultrathin substrate of the invention.

Description

technical field [0001] The invention relates to an improved method for preparing a graphene film, in particular to an improved method for preparing an ultra-thin and ultra-flexible graphene film by a vapor deposition method, and belongs to the field of preparation methods of the graphene film. Background technique [0002] Graphene, English name Graphene, is a two-dimensional lattice structure in which carbon atoms are arranged in a hexagonal manner. This graphite crystal thin film has become the focus of scientific and industrial attention since it was discovered by scientists at the University of Manchester in 2004. The thickness of graphene is only 0.335 nanometers, which is not only the thinnest among known materials, but also very firm, hard and flexible; as a single substance, it transfers electrons faster than all known conductors and semiconductors at room temperature. Fast, and the intrinsic mobility can reach 2×105cm2 / (V·S). These excellent characteristics make it...

AI Technical Summary

Problems solved by technology

The resin transfer method is to pre-coat a layer of resin glue on the surface of the target substrate, and then paste the graphene / copper foil and cure it. After curing, the copper foil can be etched and removed; this method is not suitable for ultra-thin and ultra-thin The transfer of flexible graphene film (the radius of curvature under conventional bending test conditions can be extremely small, so it is called superflexible), because the coated resin glue itself has a certain thickness, and the flexibility of the resin after curing is not very good , so the flexibility of the transferred graphene will be deteriorated, which is not conducive to the exertion of graphene's superflexible properties.

[0004] Immediately adopt the adhesive film transfer method, because the thickness of the ultra-thin and ultra-flexible target substrate is extremely thin, only about 10 microns or even thinner. The development of transfer technology on flexible target substrates makes the technology unable to move forward

[0005] (1) During the actual transfer operation, the surface of the substrate is prone to poor appearance such as folds and scratches;

[0006] (2) And after bonding with graphene / adhesive film, it is easy to have defects such as bubbles and wrinkles, which will affect the complete transfer of graphene

[0011] Another example: Then, during the graphene transfer process, put the ultra-thin substrate on the suction platform on one side of the screen laminating machine, and put the adhesive film / graphene on the suction platform on the other side, Then stick them together, but the problem is that at first, in the process of taking the ultra-thin substrate from the laminated car and putting it on the suction platform (and the above-mentioned process of putting it on the laminated car one by one), due to The substrate is too thin and it is not easy to handle. If you are not careful, it will cause defects such as folds or scratches. Secondly, even if it has the function of an air suction platform, the ultra-thin substrate will not be flat no matter how you put it. Even if you constantly adjust each side The position of the corner cannot be completely flat. After ruminative research, it is concluded that the shrinkage rate of the ultra-thin substrate is different in different directions during the pre-shrinking process, which leads to this problem.

[0012] Another example: Then a new problem appeared in the process of laminating with the adhesive film / graphene, that is, there are wrinkles after lamination, and because the substrate is too thin, its degassing performance is not good, so the lamination Some air bubbles cannot be discharged during the fusion process, and the above-mentioned undesirable problems such as air bubbles and wrinkles appear.

These defects such as bubbles and wrinkles can affect the integrity of the graphene transfer

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