High thermal conductivity and high insulation LED light engine packaging structure and preparation method

Abstract

The invention discloses a high heat conduction high insulation LED optical engine packaging structure and a preparation method. The packaging structure comprises a heat radiator, a heat conducting glue, a circuit board, a heat conducting fixing glue, a protection silica gel, a boding wire, and an LED driving chip. The heat conducting glue is disposed between the bottom part of the circuit board and the heat radiator. The top part of the circuit board is provided with a groove, and the LED driving chip is fixedly disposed in the groove by the heat conducting fixing glue. The surface of the top part of the circuit board is provided with a gold plated copper foil circuit, the laminate of which is in a circuit connection with the LED driving chip by the bonding wire. The protection silica gel is disposed in a space formed by the LED driving chip, the bonding wire, and the circuit board, and therefore the LED driving chip and the bonding wire are not exposed. The high heat conduction high insulation LED optical engine packaging structure has advantages of simple structure and good heat dissipation performance. The preparation method is simple, and production links are reduced, and therefore costs are saved.

Description

technical field [0001] The invention relates to the field of light-emitting diode packaging structures, in particular to a light-emitting diode packaging structure and a preparation method. Background technique [0002] The LED light engine is composed of an LED driving power supply and an LED light emitting device arranged on a circuit board. In the current production of LED light engines, LED drive power usually uses packaged integrated circuits, and the assembly is completed through SMT technology. Generally speaking, the LED integrated circuit is fixed on the circuit board by SMT process to complete the circuit function. However, the circuit board is made of a flat aluminum base to support the rigidity of the circuit board, the middle layer is a non-conductive filling material, and the upper layer is a copper foil circuit layer. Such as figure 1 As shown, the LED driver chip 6 is packaged on a right angle with a pin 12 to fix the LED driver chip 6 with thermally condu...

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Problems solved by technology

[0005] In order to overcome the deficiencies of the prior art, the object of the present invention is to provide a LED light engine packaging structure with high thermal conductivity and high insulation, which can solve the problem of low thermal conductivity of the LED light engine packaging structure in the prior art

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