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Preparation method for silicon-dioxide-coated copper electronic paste used for LTCC substrate

A silicon dioxide, electronic paste technology, applied in cable/conductor manufacturing, circuits, electrical components, etc., can solve the problems of uneven glass distribution, complicated glass powder procedures, uneven silver coating, etc. Good electrical conductivity and the effect of reducing production costs

Inactive Publication Date: 2016-09-21
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the research on silver paste has basically been quite mature. In order to further reduce the cost, some domestic researchers use silver-coated copper to prepare paste, but there are problems of uneven silver coating and high cost.
In recent years, domestic research on copper paste has been increasing, and most researchers still use the traditional method of mixing copper powder, glass powder, and organic carriers to make a paste, resulting in uneven distribution of glass
In addition, the preparation process of traditional slurry is more complicated, and the procedure of preparing glass powder is more complicated. In order to meet the performance requirements, some of them also contain heavy metals such as lead and cadmium or relatively expensive raw materials such as bismuth.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] (1) Pretreatment copper powder

[0030] Put 8g of original copper powder into diluted hydrochloric acid solution (HCl:H 2 (2=1mL:50mL), stir magnetically in a water bath at 30°C for 10min, let stand and pour off the supernatant; then add 30ml of acetone, stir at 60°C for 30min, let stand and pour off the supernatant, and dry at 70°C for 1h;

[0031] (2) TEOS pre-hydrolysis

[0032] Weigh 70ml of absolute ethanol, add 0.36ml of distilled water, add 1.12ml of TEOS, drop in 0.5ml of 25wt% ammonia water, stir at 25°C for 30min, and prepare the TEOS pretreatment solution;

[0033] (3) Preparation of silica-coated copper powder

[0034] Ultrasonically disperse 3g of the copper powder treated in step (1) in 30ml of absolute ethanol, then drop all the TEOS pretreatment solution in step (2) into it, react at 25°C for 3h, centrifuge the reaction product at 2500r / min for 3min, and place it at 65 Dry at ℃ for 1h;

[0035] (4) Preparation of organic vehicle

[0036] Weigh 85wt%...

Embodiment 2

[0040] (1) Pretreatment copper powder

[0041] Put 8g of original copper powder into diluted hydrochloric acid solution (HCl:H 2 (2=3mL:50mL), stir magnetically in a water bath at 30°C for 20min, let stand and pour off the supernatant; then add 30ml of acetone, stir at 60°C for 30min, let stand and pour off the supernatant, and dry at 70°C for 1h;

[0042] (2) TEOS pre-hydrolysis

[0043] Weigh 70ml of absolute ethanol, add 0.18ml of distilled water, add 0.56ml of TEOS, drop in 0.25ml of 25wt% ammonia water, and stir at 45°C for 60min to prepare the TEOS pretreatment solution;

[0044] (3) Preparation of silica-coated copper powder

[0045] Ultrasonically disperse 3g of the copper powder treated in step (1) in 30ml of absolute ethanol, then drop all the TEOS pretreatment solution in step (2) into it, react at 25°C for 4h, centrifuge the reaction product at 2500r / min for 3min, and place it at 65 Dry at ℃ for 1h;

[0046] (4) Preparation of organic vehicle

[0047] Weigh 87...

Embodiment 3

[0051] (1) Pretreatment copper powder

[0052] Put 8g of original copper powder into diluted hydrochloric acid solution (HCl:H 2 (0=5mL: 50mL), stirred magnetically in a water bath at 30°C for 15min, then poured off the supernatant; then added 30ml of acetone, stirred at 60°C for 25min, stood still, poured off the supernatant, and dried at 70°C for 1h.

[0053] (2) TEOS pre-hydrolysis

[0054] Weigh 70ml of absolute ethanol, add 0.12ml of distilled water, add 0.34ml of TEOS, drop in 0.2ml of 25wt% ammonia water, and stir at 35°C for 40min to prepare the TEOS pretreatment solution;

[0055] (3) Preparation of silica-coated copper powder

[0056]Ultrasonically disperse 3g of the copper powder treated in step (1) in 30ml of absolute ethanol, then drop all the TEOS pretreatment solution in step (2) into it, react at 45°C for 6h, centrifuge the reaction product at 2500r / min for 2min, and place it at 65 Dry at ℃ for 1h;

[0057] (4) Preparation of organic vehicle

[0058] Weigh...

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Abstract

The invention discloses a preparation method for silicon-dioxide-coated copper electronic paste used for an LTCC substrate. Copper powder is preprocessed by diluted hydrochloric acid firstly; then TEOS is pre-hydrolyzed; the surface of the copper powder is coated with silicon dioxide by adopting a sol-gel method; an organic carrier is prepared additionally; finally, the silicon-dioxide-coated copper powder and the organic carrier are mixed, and are screen printed on the LTCC substrate; and then the mixture is sintered under a nitrogen atmosphere at a temperature of 850-910 DEG C to obtain the silicon-dioxide-coated copper electronic paste / LTCC composite substrate. The copper / LTCC composite substrate prepared by the invention is relatively high in density, excellent in conductivity and low in sheet resistance; uniform diffusion of the silicon dioxide binder in the paste is realized; and in addition, the preparation method is simple in process, capable of lowering the cost, non-toxic and environment-friendly.

Description

technical field [0001] The invention relates to an electronic paste, in particular to a method for preparing silicon dioxide-coated copper electronic paste for LTCC substrates. Background technique [0002] With the development of information technology, the electronics industry has higher and higher requirements for electronic pastes. Precious metal pastes were used earlier, and silver pastes are widely used. However, in order to seek lower costs, enterprises began to widely seek base metal pastes. As a silver paste substitute. In the base metal paste, the performance of copper and silver is close, and it is an ideal substitute for silver paste. [0003] The research on electronic paste abroad is relatively early, and the technology is relatively mature, but it started late in China. However, the research on silver paste has basically been quite mature. In order to further reduce the cost, some domestic researchers use silver-coated copper to prepare paste, but there are ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B13/00
CPCH01B13/00
Inventor 杨德安董青黄超翟通
Owner TIANJIN UNIV
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