Phase change alloy thermal interface composite material and preparation method thereof

Abstract

The invention relates to a phase change alloy thermal interface composite material. Raw materials used for preparing the phase change alloy thermal interface composite material include low-melting point alloy and a heat conduction filler, and the heat conduction filler accounts for 5-85% of the total mass of the low-melting point alloy; and the low-melting point alloy includes two or above meltable metals. The low-melting point phase change alloy thermal interface composite material is in a molten state after a low melting point is reached, has extremely lower viscosity and better fluidity than heat conduction pastes, further fills gaps in the interface, greatly reduces the interface thermal resistance, and is an extremely good thermal interface material; and the low-melting point alloy is used as a dispersant, and the high conduction filler is added to the low-melting point alloy, so the composite material has dual characteristics of high heat conductivity and low interface thermal resistance.

Description

technical field [0001] The invention relates to a thermal interface composite material, in particular to a phase change alloy thermal interface composite material; the invention also relates to a preparation method of a phase change alloy thermal interface material, which belongs to the field of material science and engineering. Background technique [0002] There are very fine uneven gaps between the surface of the electronic heat source device and the heat sink. If they are directly installed together, the actual contact area between them is only 10% of the base area of ​​the heat sink, and the rest are air gaps. Because the thermal conductivity of air is only 0.024W / (m·K), it is a poor conductor of heat, which leads to a very large contact thermal resistance between the electronic components and the heat sink, which seriously hinders the conduction of heat, and finally causes the performance of the heat sink to be low. . By filling the gap with a thermal interface materi...

AI Technical Summary

Problems solved by technology

However, a large snap-in force is required to achieve a thinner thickness and finally achieve low thermal resistance; and problems of overflow and phase separation are prone to occur during use

Although the thermal conductive adhesive will not overflow, it needs to be cured at high temperature during use.

With the gradual development of electronic devices towards miniaturization and high integration, the operating speed is getting faster and faster, and the calorific value of heating electronic components is also increasing. The rise in temperature directly leads to the shortening of the service life of electronic devices

Traditional thermal interface materials are increasingly unable to meet the requirements