A method for manufacturing an inner layer copper plate exposed copper of a power battery circuit board

Abstract

A method for manufacturing a power cell circuit board while exposing copper of an internal copper plate comprises the following steps: S1, making an internal plate consisting of a copper exposure region (11) and a coverage region (12); S2, performing surface treatment; S3, pasting a high temperature adhesive tape on the copper exposure region (11); S4, covering the whole surface of the internal plate with a layer of prepreg; S5, covering the internal plate with an external circuit board, and performing lamination, drilling, desmearing, full-plate electroplating, pattern transferring, pattern electroplating, circuit etching, solder mask screen printing and profile forming; S6, cutting, by a laser machine, along a connection portion between the copper exposure region (11) and the coverage region (12) of the internal plate; and S7, removing the prepreg layer and the high temperature adhesive tape layer on the surface of the circuit board of the internal plate, to obtain the power cell circuit board. By means of the method, the prepreg in the copper exposure region (11) in the internal plate is effectively removed, so that no adhesive stain is left on the copper exposure region (11), and prepreg residues are avoided; the quality of the circuit board is improved; moreover, the method is suitable for proofing or batch production, so that the production costs are reduced, the production period is shortened, and the production efficiency is improved.

Description

technical field [0001] The invention belongs to the field of circuit board production, and in particular relates to a method for producing exposed copper on an inner layer copper plate of a power battery circuit board. Background technique [0002] With the continuous development of the circuit board industry, circuit boards for various purposes also appear. At present, in addition to the traditional pursuit of precision and fineness, in recent years, due to international and domestic concerns about environmental protection issues, the rapid development of the new energy electric vehicle and motor vehicle industry has been stimulated, and the corresponding demand for circuit boards for high-current and high-voltage battery protection has also been obtained. rapid growth. [0003] Since the power battery circuit board needs to carry large current and high voltage, ordinary circuit boards can no longer meet this requirement. It is necessary to embed a certain thickness of cop...

AI Technical Summary

Problems solved by technology

[0003] Since the power battery circuit board needs to carry large current and high voltage, ordinary circuit boards can no longer meet this requirement. It is necessary to embed a certain thickness of copper plate in the circuit board, and a small part of the inner copper plate of the finished circuit board needs to be exposed for current output. , thus greatly increasing the difficulty of making circuit boards

In addition, in traditional processing, since the inner layer copper plate will be covered by the prepreg when it is pressed, the position where the inner layer copper plate is exposed needs to be made by controlled depth milling. Because the depth of controlled deep milling is not easy to control, it is easy to damage the copper, and the efficiency Low and there will be residual glue in the prepreg

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