An ultrasonic atomization pyrolysis spraying device and its application method

A technology of ultrasonic atomization and atomizing nozzles, which is applied in spraying devices, liquid spraying devices, spray booths, etc., can solve the problems of reducing the efficiency of film preparation, unable to realize the pipeline spraying of samples, etc., and achieve the effect of improving spraying efficiency.

Active Publication Date: 2018-05-11
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0006] However, the existing high-throughput ultrasonic atomization pyrolysis spraying equipment has a single atomization nozzle, which can only spray a single sample, and cannot realize sample pipeline spraying, which reduces the film preparation efficiency

Method used

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  • An ultrasonic atomization pyrolysis spraying device and its application method
  • An ultrasonic atomization pyrolysis spraying device and its application method
  • An ultrasonic atomization pyrolysis spraying device and its application method

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Embodiment Construction

[0033] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0034] see figure 1 with figure 2 , an ultrasonic atomization pyrolysis spraying device 10 of the present invention includes a casing 100, a rotating mechanism 101, a cleaning mechanism 103, a drying mechanism 105, a moving mechanism 107 and a feeding mechanism 108. Wherein the moving mechanism 107 includes a moving motor 1071 and a stage 1073. The substrate 102 is arranged on the stage 1073, and a plurality of samples are arranged on the substrate 102. The moving motor 1071 can control the stage 1073 in the X axis and Y axis. Precise movement in the axial direction ensures that...

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Abstract

The invention relates to an ultrasonic atomization pyrolysis spraying device comprising a substrate, the substrate is used to place multiple groups of samples to be sprayed; and a rotating mechanism, the rotating mechanism includes a first rotating mechanism and a second rotating mechanism, the first rotating mechanism is provided with The liquid mixer, the liquid mixer holds the solution to be sprayed, the second rotating mechanism is equipped with an atomizing nozzle, the first rotating mechanism and the second rotating mechanism rotate periodically in reverse, and can reach the spraying area above the substrate synchronously and cooperate with each other The sample to be sprayed on the sheet is sprayed. The present invention also provides a method for using the above-mentioned ultrasonic atomization pyrolysis spraying device, including providing the above-mentioned ultrasonic atomization pyrolysis spraying device, placing multiple groups of samples to be sprayed on the substrate; mechanism and the second rotating mechanism; when the first rotating mechanism and the second rotating mechanism reach the spraying area above the substrate synchronously, the liquid mixer of the first rotating mechanism cooperates with the atomizing nozzle of the second rotating mechanism to spray the sample on the substrate Go ahead and spray.

Description

【Technical field】 [0001] The invention relates to a thin film preparation device, in particular to an ultrasonic atomization pyrolysis spraying device and a use method thereof. 【Background technique】 [0002] High-performance thin film materials have very important applications in the fields of modern communication technology, photoelectric technology, photocatalysis, new energy, aviation and national defense. These materials are usually composed of binary or more elements, and the composition and structure of the materials are different, often resulting in huge differences in various physical and chemical properties of the materials. [0003] The emergence of high-throughput combined material chip technology can greatly speed up the research and development process of new materials, and can complete the traditional "trial and error" work of several months or even years in a relatively short period of time. The core of this technology is to rely on physical gas phase Deposi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05B13/04B05B16/20B05B15/20B05B15/55B05B17/06B05B13/02
CPCB05B13/0221B05B13/0421B05B15/00B05B15/20B05B15/55B05B16/20B05B17/06
Inventor 向勇胡杨
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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