Ultrasonic atomization pyrolysis spray coating device and utilization method thereof

Abstract

The invention relates to an ultrasonic atomization pyrolysis spray coating device which comprises a substrate and a rotating mechanism, wherein the substrate is used for placing a plurality of groups of samples to be subjected to spray coating; the rotating mechanism comprises a first rotating mechanism and a second rotating mechanism; the first rotating mechanism is provided with liquid mixing devices; the liquid mixing devices accommodate a solution to be sprayed; the second rotating mechanism is provided with atomization nozzles; and the first rotating mechanism and the second rotating mechanism periodically rotate and can synchronously reach a spray coating zone above the substrate to cooperate with each other to perform spray coating on the samples to be subjected to spray coating on the substrate. The invention further provides a utilization method of the ultrasonic atomization pyrolysis spray coating device. The utilization method comprises the steps that the ultrasonic atomization pyrolysis spray coating device is provided, and the plurality of groups of samples to be subjected to spray coating are placed on the substrate; the first rotating mechanism and the second rotating mechanism are periodically rotated; and when the first rotating mechanism and the second rotating mechanism synchronously reach the spray coating zone above the substrate, the liquid mixing devices of the first rotating mechanism and the atomization nozzles of the second rotating mechanism cooperate to perform spray coating on the samples on the substrate.

Description

【Technical field】 [0001] The invention relates to a thin film preparation device, in particular to an ultrasonic atomization pyrolysis spraying device and a use method thereof. 【Background technique】 [0002] High-performance thin film materials have very important applications in the fields of modern communication technology, photoelectric technology, photocatalysis, new energy, aviation and national defense. These materials are usually composed of binary or more elements, and the composition and structure of the materials are different, often resulting in huge differences in various physical and chemical properties of the materials. [0003] The emergence of high-throughput combined material chip technology can greatly speed up the research and development process of new materials, and can complete the traditional "trial and error" work of several months or even years in a relatively short period of time. The core of this technology is to rely on physical gas phase Deposi...

AI Technical Summary

Problems solved by technology

[0006] However, the existing high-throughput ultrasonic atomization pyrolysis spraying equipment has a single atomization nozzle, which can only spray a single sample, and cannot realize sample pipeline spraying, which reduces the film preparation efficiency

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