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Reduction-type electroless gold plating solution and electroless gold plating method using said plating solution

A chemical gold plating and reduction technology, applied in the field of chemical gold plating solution, can solve the problems of increased cost, difficulty in ensuring the safety of plating treatment, poor productivity, etc., and achieve the effects of saving raw materials, good precipitation selectivity, and preventing diffusion

Active Publication Date: 2016-07-06
KOJIMA CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since this technology requires the formation of a replacement gold plating film, there is a problem of increasing cost and poor productivity
[0013] In addition, when using the electroless gold plating method described in the above-mentioned patent document 2 or the reduction precipitation type electroless gold plating solution for the palladium film described in the patent document 3, although it can suppress the corrosion of the base metal nickel, the chemical gold plating bath contains highly toxic formaldehyde or formaldehyde bisulfite adducts, it is difficult to ensure safety in plating treatment operations

Method used

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  • Reduction-type electroless gold plating solution and electroless gold plating method using said plating solution
  • Reduction-type electroless gold plating solution and electroless gold plating method using said plating solution
  • Reduction-type electroless gold plating solution and electroless gold plating method using said plating solution

Examples

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Embodiment 1

[0077] In Example 1, using the reduced gold plating solution of the present invention, a copper plate is used as a substrate, and a plating film consisting of electroless nickel plating film / electroless palladium plating film / electroless gold plating film is formed on the substrate.

[0078] Adjustment of reduction type electroless gold plating solution: The composition of the reduction type electroless gold plating solution used in the present embodiment is as follows. The plating conditions (pH, liquid temperature) are shown together with the composition.

[0079] Potassium gold cyanide

5mmol / L

Dipotassium EDTA

0.03mol / L

citric acid

0.15mol / L

Hexamethylenetetramine

3mmol / L

3,3'-Diamino-N-methyldipropylamine

0.02mol / L

Thallium acetate

5mg / L

pH

8.5

liquid temperature

80℃

[0080] Manufacture of a coating film: The sample with a coating film of Example 1 consists of implementation sam...

Embodiment 2

[0086] In embodiment 2, the same reduced gold plating solution as in embodiment 1 was used, and a copper plate was used as a substrate to form a plating film consisting of electroless nickel plating film / replacement type electroless gold plating film / reduction type electroless gold plating film on the substrate. The coating film samples of Example 2 consist of implementation sample 2-1 to implementation sample 2-6. In each of the implementation samples 2-1 to 2-6, an electroless nickel plating film with a film thickness of 5 μm was formed on the surface of the copper plate, and then a displacement type electroless gold plating film with a film thickness of 0.07 μm was formed on the surface of the electroless nickel plating film. Then, using the reduction type electroless gold plating solution, a reduction type electroless gold plating film is formed on the surface of the displacement type electroless gold plating film according to each plating time condition. In addition, each...

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Abstract

The purpose of the present invention is to provide an electroless gold plating solution which does not contain harmful substances and is capable of achieving good wire bonding performance, while suppressing corrosion of a base metal. In order to achieve this purpose, an electroless plating solution that contains a water-soluble gold compound, citric acid or a citrate, ethylenediaminetetraacetic acid or an ethylenediaminetetraacetate, hexamethylenetetramine and a chain polyamine containing three or more amino groups and an alkyl group having three or more carbon atoms is employed as a reduction-type electroless gold plating solution which is used for the purpose of forming an electroless gold plating film on the surface of an object to be plated by means of electroless plating.

Description

technical field [0001] The invention relates to an electroless gold plating solution, an electroless gold plating method using the electroless gold plating solution, and a plated product subjected to plating treatment according to the electroless gold plating method. More specifically, it relates to a reduction type chemical gold plating technology that can directly perform plating treatment on the surface of the object to be plated. Background technique [0002] In recent years, on the one hand, people's demand for high performance or multi-function of electronic equipment has increased, and on the other hand, printed circuit boards used in these electronic equipment have been required to be further thinned, thinned and miniaturized. In order to cope with this demand for thinner and smaller size, the circuit pattern tends to be finer; as this circuit pattern becomes finer, advanced mounting technology is gradually being required. As a technique for joining mounting compone...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/44
CPCC23C18/1651C23C18/32C23C18/44C23C18/1637
Inventor 加藤友人渡边秀人
Owner KOJIMA CHEM CO LTD
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