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Electromagnetic wave shielding composite film

An electromagnetic wave and composite film technology, applied in the direction of magnetic/electric field shielding, electrical components, etc., can solve the problems of ineffective shielding of low-frequency electromagnetic waves, high equipment investment costs, etc., and achieve the goal of improving electromagnetic wave shielding effect, light weight, and simplifying the integration process Effect

Active Publication Date: 2020-01-17
XSENSE TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this conductive adhesive film method has the disadvantages of relatively expensive research and development and equipment investment costs and the inability to effectively shield low-frequency electromagnetic waves

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] The electromagnetic shielding composite film of this embodiment is completed by the following process steps: graphene is prepared by mechanical exfoliation, and its average thickness range can be from 0.2 nanometers to 300 nanometers, and then graphene (25% by weight), Low-viscosity macromolecular binder (40 weight percent epoxy resin), hardener (15 weight percent polyamide hardener), dispersant (0.5 weight percent anionic dispersant), organic solvent (19 weight percent butyl Mixed solvent of ketone, toluene and ethyl acetate) and additives (0.5% by weight defoamer) etc. are fully and uniformly mixed, and coated and dispersed on the surface of PET release film 112 to form incident light with high conductive function layer 110, the thickness of which is about 15 microns; then, a wave-absorbing layer 108 of nickel-chromium alloy with a thickness of 50 nm and a reflective layer 106 of copper metal with a thickness of 300 nm are sequentially formed on the surface of the inci...

Embodiment 2

[0031] The electromagnetic shielding composite film of this embodiment is completed by the following process steps: graphene is prepared by mechanical exfoliation, and its average thickness range can be from 0.2 nanometers to 300 nanometers, and then graphene (25% by weight) and Low-viscosity macromolecular binder (40 weight percent epoxy resin), hardener (15 weight percent polyamide hardener), dispersant (0.5 weight percent anionic dispersant), organic solvent (19 weight percent butyl Mixed solvent of ketone, toluene and ethyl acetate) and additives (0.5% by weight defoamer) etc. are fully and uniformly mixed, and coated and dispersed on the surface of PET release film 112 to form incident light with high conductive function layer 110, the thickness of which is about 15 microns; then, a wave-absorbing layer 108 of nickel-chromium alloy with a thickness of 50 nanometers and a reflective layer 106 of silver metal with a thickness of 200 nanometers are sequentially formed on the ...

Embodiment 3

[0033] The electromagnetic shielding composite film of this embodiment is completed by the following process steps: graphene is prepared by mechanical exfoliation, and its average thickness range can be from 0.2 nanometers to 300 nanometers, and then graphene (25% by weight) and Low-viscosity macromolecular binder (40 weight percent epoxy resin), hardener (15 weight percent polyamide hardener), dispersant (0.5 weight percent anionic dispersant), organic solvent (19 weight percent butyl Mixed solvent of ketone, toluene and ethyl acetate) and additives (0.5 weight percent defoamer) etc. are fully and evenly mixed and coated and dispersed on the surface of PET release film 112 to form an incident layer 110 with high conductive function, Its thickness is about 15 microns; then, a wave-absorbing layer 108 of nickel-chromium alloy with a thickness of 50 nanometers and a reflective layer 106 of aluminum metal with a thickness of 300 nanometers are sequentially formed on the surface of...

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Abstract

The present invention discloses an electromagnetic wave shielding composite film, which is structurally characterized by comprising a multi-layer wave-absorbing structure. The structure at least includes a reflecting layer, a wave-absorbing layer and an incident layer. The resistance value of the wave-absorbing layer is higher than the resistance value of the reflecting layer. Electromagnetic waves are guided to drift back and forth between the wave-absorbing layer and the reflecting layer, so that energy attenuation of spatially incident electromagnetic waves is facilitated. Meanwhile, reflected electromagnetic waves are reduced or eliminated. Therefore, the electromagnetic wave shielding composite film has a multi-layer wave-absorbing structure, so that the interference of electromagnetic waves on adjacent lines and components is avoided. In addition, the thickness of the multi-layer wave-absorbing structure is thinned. As a result, the requirements of flexible circuit boards, such as light weight, thinned material and good flexibility, can be met.

Description

technical field [0001] The invention relates to an electromagnetic wave shielding composite film, in particular to an electromagnetic wave shielding composite film with a multi-layer wave-absorbing structure. Background technique [0002] In order to respond to the multi-functional market demand of electronic and communication products, the IC structure of the circuit substrate needs to be lighter, thinner, shorter, and smaller; in terms of function, it needs to be powerful and high-speed signal transmission. Therefore, the density of the number of I / O pins is bound to increase, and the number of IC pins must also increase accordingly. The distance between the IC substrate lines is getting closer and closer, and the operating frequency is moving towards high-bandwidth, which makes the electromagnetic interference (Electromagnetic Interference; EMI) between ICs more and more serious. Therefore, how to effectively manage electromagnetic compatibility ( Electromagnetic Compati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K9/00
CPCH05K9/0088
Inventor 刘伟仁范晏宁沈骏
Owner XSENSE TECH CORP
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