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Laser cutting method and system of SIP (System in Package) module

A cutting method and cutting system technology, applied in welding equipment, laser welding equipment, metal processing equipment, etc., can solve the problems of lower process yield, invalid shielding effect, and easy peeling off of the coating, so as to improve the process yield and not easy to fall off , Reduce the effect of dust splashing phenomenon

Active Publication Date: 2016-07-06
HUANWEI ELECTRONICS SHANGHAI CO LTD
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the existing technology, when laser cutting is used for packaged products, problems of copper powder splashing and product carbonization are prone to occur. This problem makes the coating of the SIP module after sputtering in the subsequent process easier to fall off, making the shielding effect failure, reducing the process yield

Method used

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  • Laser cutting method and system of SIP (System in Package) module
  • Laser cutting method and system of SIP (System in Package) module
  • Laser cutting method and system of SIP (System in Package) module

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Embodiment Construction

[0041] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific implementation manners of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention, and those skilled in the art can obtain other accompanying drawings based on these drawings and obtain other implementations.

[0042] In order to make the drawing concise, each drawing only schematically shows the parts related to the present invention, and they do not represent the actual structure of the product. In addition, to make the drawings concise and easy to understand, in some drawings, only one of the components having the same structure or function is schematically shown, or only one of them is marked. Herein, "a" not only means "only one", but also means "more than one".

[0043] In one emb...

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Abstract

The invention discloses a laser cutting method and a laser cutting system of an SIP (System in Package) module, which relate to the field of laser cutting. The laser cutting method comprises the steps of S10 obtaining contour data of the SIP module, wherein the contour data comprises a cutting path and a cutting position; S20 cutting a part of plastic packaging material of a circle around the contour of the SIP module by adopting laser according to preset groove cutting data and the obtained contour data, so as to form a radiating groove; S30 cutting the SIP module by adopting laser according to the obtained contour data and preset contour cutting data after the groove is formed until the SIP module is cut off. Before normal cutting, the radiating groove for removing chips is formed around the SIP module, then the normal cutting is performed, then the SIP module after the normal cutting is polished, and remaining dust and carbide are removed, so that good coating adhesion ability of the SIP module is kept in the subsequent manufacturing process, and the qualified rate of the manufacturing process is increased.

Description

technical field [0001] The invention relates to the field of laser cutting, in particular to a method and system for laser cutting of SIP modules. Background technique [0002] Among the traditional cutting technologies for semiconductor packaging products, blade cutting technology is mainly used, but there are certain problems in blade cutting technology, such as: only straight lines can be cut, but products with curved shapes cannot be cut; the cutting process requires cooling circulating water to impact chip removal, impact The force is easy to affect the product quality; the blade movement speed is limited, and the cutting speed is slow; the blade consumables need to be maintained and replaced regularly, and the cost is high; the noise is large, which endangers the physical and mental health of operators, etc. Therefore, laser cutting is applied to the field of semiconductor packaging. [0003] In the field of semiconductors, system-in-package (SIP, SystemInaPackage) is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38
CPCB23K26/38
Inventor 孟新玲宋浩真张亮
Owner HUANWEI ELECTRONICS SHANGHAI CO LTD
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