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Flexible-rigid combined board and terminal

A soft-rigid combination board and rigid technology, applied in the structural connection of printed circuits, circuit electrostatic discharge protection, circuit bendable/stretchable components, etc., can solve circuit structure damage, affect service life, and poor strength and other problems to achieve the effect of improving service life, enhancing assembly strength, and improving electrostatic shielding performance

Active Publication Date: 2016-06-15
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to reduce the thickness of the rigid-flex board, the rigid insulating layer is usually thinned, so the strength of the hard insulating layer is reduced, resulting in a decrease in the rigidity of the rigid-flex board, so that the rigid-flex board is faced with high-strength assembly. under request, easily broken and damaged
In order to improve the structural strength of the rigid-flex board, the usual practice is to add steel sheets to the rigid-flex board for reinforcement. Since the steel sheet is easy to accept static electricity, it is easy to damage the circuit structure on the rigid-flex board. Therefore, the current rigid-flex board There are problems such as poor strength and easy damage of the bonding plate that affect the service life

Method used

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  • Flexible-rigid combined board and terminal

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Embodiment Construction

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.

[0018] see figure 1 , the present invention provides a rigid-flex board 100 , the rigid-flex board 100 includes a flexible substrate 10 , a rigid substrate 20 and a steel sheet 30 . The flexible substrate 10 includes a first region 11, the rigid substrate 20 includes a hard insulating layer 21, a circuit layer 22 and a solder resist ink layer 23, the hard insulating layer 21 is fixed on the flexible substrate 10, and The orthographic projection area on the flexible substrate 10 coincides with the first region 11 . The circuit layer 22 is arranged on the hard insulating layer 21 , and the solder resist ink layer 23 covers the circuit layer 22 . The solder resist ink layer 23 is provided with at least one grounding via 231, and the grounding via 231 is provided with a ground c...

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Abstract

The invention provides a flexible-rigid combined board and a terminal. The flexible-rigid combined board comprises a flexible substrate, a rigid substrate and a steel sheet, wherein the flexible substrate comprises a first region; the rigid substrate comprises a rigid insulating layer, a line layer and a solder mask layer; the rigid insulating layer is fixed on the flexible substrate and is orthographically projected on the flexible substrate; the projection region overlaps with the first region; the line layer is superposed on the rigid insulating layer; the solder mask layer covers the line layer; at least one grounding through hole is formed in the solder mask layer; a grounding conductor which is electrically connected with the line layer is arranged in the grounding through hole; the steel sheet is fixed on the solder mask layer and is electrically connected with the grounding conductor; and the steel sheet is orthographically projected in the first region of the flexible substrate. The steel sheet can strengthen the assembly strength of the flexible-rigid combined board; and the grounding conductor makes the steel sheet grounded and prevents the steel sheet from receiving static electricity, so that the service lifetime of the flexible-rigid combined board is prolonged.

Description

technical field [0001] The invention relates to the field of electronic equipment, in particular to a rigid-flex board and a terminal. Background technique [0002] At present, the application of rigid-flex boards is becoming more and more extensive. The structure of rigid-flex boards is to set a hard insulating layer on a flexible substrate, then set a circuit layer on the hard insulating layer, and cover the circuit layer with a solder resist ink layer. , so as to realize the rigid circuit board structure of the soft and rigid board. However, in order to reduce the thickness of the rigid-flex board, the rigid insulating layer is usually thinned, so the strength of the hard insulating layer is reduced, resulting in a decrease in the rigid strength of the rigid-flex board, so that the rigid-flex board is faced with high-strength assembly. Under the requirement, it is easy to break and damage. In order to improve the structural strength of the rigid-flex board, the usual me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/14H05K3/36
CPCH05K1/0259H05K1/147H05K3/365H05K2201/058H05K3/0061H05K2201/2009H05K1/0281H05K1/0215
Inventor 陈鑫锋
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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