Frit contact membrane layer and OLED packaging structure with frit contact membrane layer
A technology of packaging structure and glass frit, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems affecting the packaging strength and water and oxygen barrier ability, so as to enhance the packaging strength, enhance the ability to block water and oxygen, and increase contact area effect
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[0019] In order to further illustrate the technical means and functions adopted by the present invention to achieve the intended purpose of the invention, the present invention will be described in detail below in conjunction with the accompanying drawings and preferred embodiments.
[0020] figure 1 Shown is a schematic cross-sectional view of the OLED packaging structure provided by the present invention. figure 2 Shown is a schematic top view of the OLED packaging structure provided by the present invention. Such as figure 1 and figure 2 As shown, the OLED packaging structure of the present invention includes a glass substrate 10, a packaging cover plate 20, an OLED element 30 on the glass substrate 10, a glass frit contact film layer 40, and a glass between the glass substrate 10 and the packaging cover plate 20. Material 50.
[0021] further reference figure 2 , the glass substrate 10 is a rectangular structure, which includes a rectangular display area 11 and a r...
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