Organic solidification curing resistor slurry and preparation method thereof

Abstract

The invention discloses an organic solidification curing resistor slurry and a preparation method thereof. The organic solidification curing resistor slurry comprises a resistor function phase and an organic carrier, wherein the resistor function phase comprises super fine silver powder and super fine silicon carbide powder, the organic carrier comprises high temperature prevention resin, a high-molecular fire retardant, a solvent and an additive, the additive comprises a liquid antifoaming agent, a liquid levelling agent, a liquid anti-settling agent, a thixotropic agent, an eleaostearic acid salt heat stabilizer and an infiltration dispersant. The organic solidification curing resistor slurry can effectively solve a technical problem that thinning, lightening or specialization are not easy to realize in the prior art, 130-200 DEG C curing can be further realized, and the characteristic that the organic solidification curing resistor slurry can be used in relatively high temperature of 300 DEG C can be realized. The preparation method comprises steps that a, the resistor function phase is prepared; b, additives are prepared; c, the organic carrier is prepared; d, pre-mixing of the resistor function phase and the organic carrier is carried out; and e, a three-roller grinder is employed for grinding. Through the method, the organic solidification curing resistor slurry can be effectively prepared.

Description

Technical field [0001] The invention relates to the technical field of organic electric heating materials for heaters, in particular to an organic solidified resistor paste and a preparation method thereof. Background technique [0002] The heating method of ordinary heaters uses traditional nickel-chromium alloy and other resistance wires or resistive films as heating materials. With the continuous improvement of the performance, structure, safety, and environmental protection requirements of the heater at home and abroad, especially in the high-tech field, the heating The thinness, miniaturization, and specialization performance of the device put forward higher requirements. For the traditional nickel-chromium alloy resistance wire or resistance film, it has been unable to meet the technical development requirements. [0003] It should be further pointed out that the existing resistance wire heaters or resistance film heaters have the following shortcomings, specifically: [0004...

AI Technical Summary

Problems solved by technology

[0004] 1. The manufacturing process of resistance wire or film is complicated, the production cycle is long, and the production cost is high;

[0005] 2. The manufacturing process of the heating plate is complicated, and it is difficult to realize thinning and lightening of the heating plate;

[0006] 3. The resistance wire or film is easy to detach from the substrate, and the resistance film is easy to detach from the substrate, resulting in a reduction in product life;

[0007] 4. Limited by the shape of the resistance wire, it is difficult to miniaturize and thin the heater;

[0008] 5. The thickness consistency of the resistive film is not easy to control, and it is easy to cause low yield rate; and the circuit is prepared by etching, which is not conducive to environmental protection