Preparation method for electronic packaging material

An electronic packaging material and packaging material technology, which are applied in the preparation of electronic packaging materials and the field of aluminum alloy substrates, can solve problems such as manufacturing process and welding performance problems, and achieve changing machining difficulties, improving reliability and integration. The effect of considerable economic and social benefits

Inactive Publication Date: 2016-05-04
AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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Problems solved by technology

[0005] The existing SiC / Al composite electronic packaging materials are mainly manufactured by the infiltration method, which has problems in thermal conductivity, manufacturing process and welding performance. The application in my country's active phased array radar requires a new type of packaging material to make up for the shortcomings of traditional materials

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  • Preparation method for electronic packaging material

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Embodiment Construction

[0028] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] In terms of mass fraction, graphene oxide is 2%, SiC particles are 50%, and the balance is aluminum alloy powder, and the aluminum alloy powder contains 50% Al-40Si and 50% Al-0.2Be alloy powder. The preparation steps are as follows:

[0030] (1) 1 volume of graphene oxide and 10 volumes of ethanol are mixed and dispersed with ultrasound;

[0031] (2) Add the prepared graphene oxide ethanol solution, SiC particles, and Al-Si aluminum alloy powder into a V-type mixing device for wet mixing, mix for 10 hours, and...

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Abstract

The invention provides a preparation method for an electronic packaging material. The electronic packaging material is composed of a substrate and a reinforcement body, the substrate comprises aluminum alloy, and the reinforcement body comprises graphene oxide and SiC particles. The electronic packaging material comprises, by mass, 2% of the graphene oxide, 50% of the SiC particles, and the balance aluminum alloy powder. The aluminum alloy powder comprises 50% of Al-40Si alloy powder and 50% of Al-Be alloy powder. By means of the preparation method, the light electronic packaging material with the density being lower than 3.1 g/cm<3> and the thermal conductivity being larger than 180 W/(mK) is prepared, and accordingly the combination property of military electronic equipment is improved significantly; the method is suitable for producing and preparing packaging materials for portable devices, military power hybrid circuits used for the aerospace field and other fields which are sensitive to weights, carriers of microwave tubes, heat sinks of multi-chip assemblies and super-high-power modules.

Description

technical field [0001] The invention relates to a method for preparing a packaging material, in particular to a method for preparing an electronic packaging material with an aluminum alloy matrix and graphene oxide and SiC particles as reinforcements. Background technique [0002] Electronic packaging material refers to the sealing body of integrated circuits. It not only has mechanical support and environmental protection for the chip, but also prevents it from being polluted and eroded by water vapor, impurities and various chemical atmospheres in the atmosphere, so that the integrated circuit chip can be stably To perform normal electrical functions, packaging materials play a decisive role in the thermal performance and even reliability of electronic devices and circuits. Now, the electrical packaging material industry has become an important branch of the semiconductor industry, and it has been widely involved in various disciplines such as chemistry, electricity, therm...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C21/00C22C32/00C22C29/06C22C30/00C22C1/05B22F3/10
CPCC22C21/00B22F3/10C22C1/05C22C1/051C22C29/065C22C30/00C22C32/0063C22C32/0084
Inventor 王旭东李炯利王胜强罗传彪黄粒
Owner AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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