Laser safety protection method for laser processing equipment

Abstract

The invention relates to a laser safety protection method for a laser processing device. The laser safety protection method comprises the steps that 1, a weak light irradiation module and a photoelectric detection analysis module are constructed; 2, the weak light irradiation module and the photoelectric detection analysis module are rigidly installed on the laser emitting mechanical edge of a laser processing head, and emitting light of the weak light irradiation module irradiates the laser processing area and peripheral areas of the laser processing head; and 3, material information and movement position information of an optical interface inside the irradiated areas are detected by the photoelectric detection analysis module, whether a signal with vital signs in the areas exists or not is judged, and a laser output activity and a laser processing activity are stopped through hardware, so that laser safety protection of the laser processing device is achieved. The laser safety protection method for the laser processing device has the characteristics of being simple, convenient to construct, not limited by personnel factors, objective, reliable, free of potential safety hazards, high in intelligent degree, active in protection, high in response speed, modularization degree and flexibility, capable of expanding functions easily, wide in application range and the like.

Description

technical field [0001] The invention relates to a laser processing guarantee method, in particular to a laser safety guarantee method for a laser processing device, which is mainly used for laser welding, laser cutting, laser marking, laser drilling, laser heat treatment, laser forming, laser 3D printing, etc. Laser safety assurance for laser processing devices in the field. Background technique [0002] Laser processing usually uses high-power-density laser beams to irradiate workpieces to melt and gasify materials for special processing such as perforation, cutting and welding. Laser processing that uses laser thermal effects can be called laser thermal processing. Laser processing that uses light characteristics to change material properties can be called laser cold processing. According to specific processing actions, laser processing can be divided into laser welding, laser cutting, laser marking, laser drilling, laser heat treatment, laser forming, laser 3D printing, ...

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Problems solved by technology

[0003] In the prior art, there are laser safety protection methods for laser processing devices, see the instructions and safe use specifications for laser processing devices of Italian PRIMA, Wuhan Jinyun, Wuhan Chutian, Wuhan Unity, Huagong Technology, Shenzhen Han’s and other companies, as well as the Chinese The national standard "Safety Requirements for Laser Processing Machinery" issued by the General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, standard number: GB / T18490-2001, these prior laser safety protection methods for laser processing devices have considerable advantages, but there are still some essential Insufficient: 1) The safety protection method is aimed at the use of the device and the various links in the use process to regulate the behavior of personnel. If the user does not follow the specifications or has misoperations during use, the process is cumbersome and there are still threats to safety 2) The method used in the laser processing device itself is to remind the warning signs, evaluate the safety level according to the characteristics of the laser equipment using the laser, and set the safety warning signs on the equipment, which also requires personnel to know the signs and have the ability to A certain knowledge background requires human-computer interaction in the process, and there are requirements for the device to be close to personnel, resulting in loopholes in safety protection; 3) Lack of laser safety protection measures for the laser processing device itself, the safety assurance level is low, and the laser processing device does not realize safety identification and analysis functions, low degree of intelligence, poor flexibility, and slow response speed of laser safety protection methods

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