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Ultrathin film material for electronic product and preparation method thereof

An electronic product and ultra-thin film technology, applied in the field of ultra-thin film materials for electronic products and their preparation, can solve problems such as the inability of performance to meet the needs of industrialization, and achieve the effects of being conducive to environmental protection development, avoiding volatilization, and simple and easy-to-obtain raw materials

Active Publication Date: 2016-04-06
WUJIANG XINTA FORWARD HARDWARE FACTORY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, with the development of electronic equipment, electronic materials, especially thin film materials, are required to develop towards ultra-thin. Although there are electronic thin film materials with a thickness of less than 50 microns, their performance cannot meet the needs of industrialization.

Method used

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  • Ultrathin film material for electronic product and preparation method thereof
  • Ultrathin film material for electronic product and preparation method thereof
  • Ultrathin film material for electronic product and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Add 100g of diisoprene diepoxide into 380g of ethylene glycol, stir at 150°C for 15 minutes, then add 18g of 3-tridecafluorohexylpropene, adjust the temperature to 90°C, and add 10g of 1% superhydrogen Oxidize diisopropyl dicarbonate ethylene glycol solution, stir at 90°C for 8 hours; then remove the solvent by rotary evaporation to obtain fluorine-containing epoxy; add 20g of N-methylphenethylamine to 80g of ethanol, stir and mix for 30 minutes, Then add 2g of ytterbium fluoride and 5g of zirconia, mix for 1 hour, then add 12g of tetrahydroquinoline compound, mix for 2 hours, then add 1.5g of graphite powder; stir at 90°C for 5 minutes to obtain the mixture; then add 30g of fluorine-containing Epoxy, 8g trimethylchlorosilane were added to the mixture, and stirred at 110°C for 25 minutes to obtain a membrane material precursor; a mixed solvent was composed of 10g Tween-20, 100g water and 80g ethanol, and the membrane material precursor was dissolved in A mixed solution ...

Embodiment 2

[0026] Add 100Kg of diisoprene diepoxide into 380Kg of ethylene glycol, stir at 150°C for 15 minutes, then add 18Kg of 3-tridecafluorohexylpropene, adjust the temperature to 90°C, and add 10Kg of 1% supernatant Oxidize diisopropyl dicarbonate ethylene glycol solution, stir at 90°C for 8 hours; then remove the solvent by rotary evaporation to obtain fluorine-containing epoxy; add 20Kg N-methylphenethylamine to 80Kg ethanol, stir and mix for 30 minutes, Then add 2Kg of ytterbium fluoride and 5Kg of zirconia, mix for 1 hour, then add 12Kg of tetrahydroquinoline compound, mix for 2 hours, then add 1.5Kg of graphite powder; stir at 90°C for 5 minutes to obtain the mixture; then add 30Kg of fluorine-containing Epoxy, 8Kg trimethylchlorosilane was added to the mixture, and stirred at 110°C for 25 minutes to obtain a membrane material precursor; 10Kg Tween-20, 100Kg water and 80Kg ethanol were used to form a mixed solvent, and the membrane material precursor was dissolved in A mixed s...

Embodiment 3

[0028] Add 100Kg of diisoprene diepoxide into 380Kg of ethylene glycol, stir at 150°C for 15 minutes, then add 18Kg of 3-tridecafluorohexylpropene, adjust the temperature to 90°C, and add 10Kg of 1% supernatant Oxidize diisopropyl dicarbonate ethylene glycol solution, stir at 90°C for 8 hours; then remove the solvent by rotary evaporation to obtain fluorine-containing epoxy; add 20Kg N-methylphenethylamine to 80Kg ethanol, stir and mix for 30 minutes, Then add 2Kg of ytterbium fluoride and 5Kg of zirconia, mix for 1 hour, then add 12Kg of tetrahydroquinoline compound, mix for 2 hours, then add 1.5Kg of graphite powder; stir at 90°C for 5 minutes to obtain the mixture; then add 30Kg of fluorine-containing Epoxy, 8Kg trimethylchlorosilane was added to the mixture, and stirred at 110°C for 25 minutes to obtain a membrane material precursor; 10Kg Tween-20, 100Kg water and 80Kg ethanol were used to form a mixed solvent, and the membrane material precursor was dissolved in A mixed s...

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Abstract

The invention relates to an ultrathin film material for electronic product and a preparation method thereof. The method is as below: first reacting diisoprene diepoxide with 3-tridecylfluorooctyl propylene in the presence of diisopropyl peroxydicarbonate to obtain an epoxy substance containing fluorine; then mixing N-methylphenethylamine ytterbium fluoride, and zirconia, then adding a tetrahydroquinoline compound and graphite; finally adding the fluorine-containing epoxy substance and trimethylsilyl chloride to obtain a film material precursor; f dissolving the film material precursor in a composite solvent to prepare a mixed solution with solid content of 75%; then spraying the mixed solution on a substrate, drying at 93 DEG C, curing at 180 DEG C to obtain the ultrathin film material for electronic products. The disclosed preparation method has wide source of raw materials, and simple and controllable manufacturing process only requiring routine operation, and is easy for industrialization.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to an ultra-thin film material for electronic products and a preparation method thereof. Background technique [0002] The side-chain fluorine-containing alkyl polysiloxane epoxy compound combines the advantages of organic fluorine and silicone, and provides excellent properties such as folding resistance, heat resistance, and adhesion, so it is widely used as a surface treatment for electronic devices (components) Material. Epoxy resin has excellent adhesion, thermal stability and excellent chemical resistance. As a resin matrix for adhesives, coatings and composite materials, it is widely used in water conservancy, transportation, machinery, electronics, home appliances, automobiles and aerospace However, epoxy resin contains a large number of epoxy groups, and after curing, it has high crosslinking density, brittle texture, poor weather resistance and mo...

Claims

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Application Information

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IPC IPC(8): C08G59/24C08J5/18
CPCC08G59/24C08J5/18C08J2363/00
Inventor 杨和荣
Owner WUJIANG XINTA FORWARD HARDWARE FACTORY
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