Lamination device of film

Abstract

The present invention provides a lamination device of film, the bad conditions of productions are reduced in the lamination process of formation of thin patterns of a substrate through preventing from forming slight injury of the lamination film of exposure obstacle. Transmission mechanisms (1, 3) with substrates (4a, 4b and 4c) peel off a protective film (16) of the lamination film and are attached to the substrate. A film length adjustment mechanism (13) for changing the attachment length change of the film corresponding to the length of the substrate is arranged between a blade (14) and a semi-cutting position. Prior to the lamination, the film length adjustment mechanism is configured to cut the position of the lamination film (9) at a sheet of the substrate attachment length, and a film carrying mechanism is configured to carry the continuous protective films to the blade near a lamination roller (20) in the mode without peeling off the protective film from the lamination film.

Description

technical field [0001] The present invention relates to a film lamination device, and more particularly to a film lamination device for affixing a photosensitive dry film for pattern formation or the like to a laminated film on a substrate surface of a printed circuit board. Background technique [0002] In the context of technological innovation centering on mobile devices and mobile phones, miniaturization and weight reduction of printed circuit boards, especially substrates, have become important issues. [0003] For miniaturization of substrates, miniaturization of patterns formed on substrates and multilayering of substrates are progressing, and for weight reduction, thinning of substrates is progressing. [0004] Here, pattern formation is mainly referred to as a photolithography process, and laminated thin films such as photosensitive dry films are laminated on copper-clad laminates, followed by exposure, development, etching, or plating to form patterns. [0005] Th...

AI Technical Summary

Problems solved by technology

[0008] In the miniaturization of the pattern of the printed circuit board, the problem in the lamination process is that when the laminated film is attached to the substrate, the base film is sucked and transported or the base film is sucked and held. In the process of sliding and moving the film, fine scratches are generated on the base film on the side of the adsorption surface due to the influence of the edge such as the chamfering of the adsorption hole of the adsorption plate that absorbs the film.

[0014] In addition, if foreign matter such as resist chips generated when cutting the film and cut chips of the base film falls on the bonding substrate, the foreign matter will be mixed between the resist portion and the substrate, resulting in poor resist bonding.

In this case, the same adverse effect as the above-mentioned poor resist lamination will occur.

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