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Silver-copper-indium-titanium middle-temperature brazing filler metal

A technology of soldering and warm brazing, applied in welding/cutting media/materials, welding media, welding equipment, etc., can solve problems such as low content of active element titanium, poor wettability of base metal and seam filling, insufficient activity, etc., to achieve The effect of avoiding cracking and reducing residual thermal stress

Inactive Publication Date: 2016-03-30
AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the content of active element titanium in the brazing filler metal is relatively low, and when brazing SiO 2f / SiO 2 Insufficient activity when composite ceramics, relatively poor ability to wet the base material and fill gaps

Method used

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  • Silver-copper-indium-titanium middle-temperature brazing filler metal
  • Silver-copper-indium-titanium middle-temperature brazing filler metal

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Embodiment Construction

[0013] Below in conjunction with embodiment technical solution of the present invention will be described in further detail:

[0014] Table 1 shows the examples of the solder described in the technical solution of the present invention and the chemical composition and weight percentage composition of each example.

[0015]

[0016]

[0017] The above-mentioned brazing material can be used in the form of alloy block, alloy rolling strip, alloy powder, element mixed powder, or quenched foil strip brazing material made by rapid solidification technology as required. The specific preparation method is as follows: For the alloy block, the block of the required shape and size is cut out from the smelted brazing material ingot by machining method; Foil strip preparation equipment Two methods of preparation are strip stripping; powder solder is mainly prepared by mixing pure metal powder in proportion and by atomizing powder.

[0018] The method of brazing using the above high ...

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Abstract

The invention belongs to the technical field of welding, and relates to a silver-copper-indium-titanium brazing filler metal used for connecting SiO2f / SiO2 composite ceramics and metals (such as tungsten, molybdenum, tungsten-molybdenum alloy, niobium, niobium-molybdenum alloy, invar alloy and kovar alloy). The silver-copper-indium-titanium brazing filler metal is characterized by comprising, by weight percentage, 19.2-28.2% of Cu, 8.2-19.4% of In, 3.5-7.2% of Ti, and the balance Ag. The brazing filler metal is good in machinability, and can be machined into strips, and required brazing temperature is lower than that of a traditional Ag-Cu-Ti brazing filler metal by about 100 DEG C, so that the silver-copper-indium-titanium brazing filler metal has a great significance in the field of ceramic and metal brazing connection in the aspect of reducing post-welding residual thermal stress of joints. The brazing filler metal not only is suitable for connecting the SiO2f / SiO2 composite ceramics and metals, and is also suitable for connecting ceramics, or connecting ceramics and metals, or connecting metals owing to excellent activity of the brazing filler metal.

Description

technical field [0001] The invention relates to a silver-copper-indium-titanium brazing material, which is suitable for SiO 2f / SiO 2 The invention relates to the connection of composite ceramics and metal materials, which belongs to the field of medium-temperature brazing materials. Background technique [0002] For the thermal expansion coefficient is only 0.33×10 -6 K -1 SiO 2f / SiO 2 For composite ceramics, due to the huge difference in thermal expansion coefficient between it and the metal, there is a very large thermal stress in the joint connected to the metal, and in some cases, the welded joint even directly cracks. In order to alleviate the thermal stress caused by the mismatch of the thermal expansion coefficients of the two materials in the joint of ceramic and metal dissimilar materials, the usual solution is: (1) Fill the thermal expansion coefficient between the metal and the ceramic between the two slow-release layer material or excellent plasticity slo...

Claims

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Application Information

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IPC IPC(8): B23K35/30B23K103/18B23K1/008
CPCB23K35/3006B23K1/008B23K35/0222B23K2103/18
Inventor 陈波熊华平邹文江吴欣
Owner AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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