Ultrasonic or mega-sonic oscillatory two-phase-flow atomization washing device and ultrasonic or mega-sonic oscillatory two-phase-flow atomization washing method

Abstract

The invention discloses an ultrasonic or mega-sonic oscillatory two-phase-flow atomization washing device and an ultrasonic or mega-sonic oscillatory two-phase-flow atomization washing method. An ultrasonic wave generation unit or a mega-sonic wave generation unit is arranged inside a nozzle main body and along the surface of the inner wall of a liquid pipeline; by generation of ultrasonic or mega-sonic oscillation, the ultrasonic or mega-sonic energy is transmitted into washing liquid which the energy passes through, so that atomized particles formed by intersection of the washing liquid ejected from a liquid guide outlet and air ejected from an air guide outlet below a gas-liquid guide component are enabled to have ultrasonic or mega-sonic energy and are downwards ejected towards a wafer surface under the acceleration or vertical guidance effect of an atomized particle guide outlet so as to realize ultrasonic or mega-sonic atomization washing; damages caused to a graphic structure of the wafer surface are effectively controlled; the removal efficiency of particle pollutants on the wafer surface is improved; the process time is shortened; the amount of washing liquor and high-purity gas is reduced; the production cost is lowered; environmental influences are reduced.

Description

technical field [0001] The present invention relates to the technical field of semiconductor cleaning equipment, more specifically, to a two-phase flow atomization cleaning device with ultrasonic or megasonic oscillation and a cleaning method using the device. Background technique [0002] With the rapid development of semiconductor integrated circuit manufacturing technology, the graphic feature size of integrated circuit chips has entered the deep sub-micron stage, and the feature size of key contaminants (such as particles) that cause failure or damage to ultra-fine circuits on the chip has also increased. greatly reduced. [0003] During the manufacturing process of integrated circuits, semiconductor wafers usually go through multiple process steps such as film deposition, etching, and polishing. And these process steps just become the important place that the contamination produces. In order to maintain the clean state of the wafer surface and eliminate the contaminan...

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Problems solved by technology

[0012] The purpose of the present invention is to overcome the above-mentioned defects existing in the prior art, and to provide a two-phase flow atomization cleaning device and cleaning method with ultrasonic or megasonic oscillation, by designing ultrasonic or megasonic cleaning and two-phase flow atomization cleaning The combined new nozzle structure can effectively solve the problem of damage to the side wall and corner of the wafer pattern, improve cleaning quality and efficiency, and save cleaning costs

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