Method and device for rapidly leaching out gold in waste circuit board

A waste circuit board, leaching technology, applied in the direction of improving process efficiency, etc., can solve the problems of increased recycling cost, long time consumption, slow reaction speed, etc., and achieve the effect of improving leaching efficiency

Inactive Publication Date: 2016-03-16
FUJIAN UNIV OF TECH
View PDF5 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen that adopting this potassium iodide-iodine method for the leaching of gold in waste circuit boards has the following disadvantages: 1. the reaction speed is slow, and it takes a long time (need to reach 4 hours), and 2. the leaching efficiency of gold is low (97.5%), 3. Need to use auxiliary oxidant hydrogen peroxide, increase recovery cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for rapidly leaching out gold in waste circuit board
  • Method and device for rapidly leaching out gold in waste circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Such as figure 1 and figure 2 As shown, in step 1, the main board and components of the waste circuit board are separated, the components are sorted and processed separately, and the main board of the circuit board is processed into fragments smaller than 1cm by a shearing machine. First, pretreat the circuit board fragments with nitric acid, and the pretreatment conditions are as follows: the solid-to-liquid ratio is 1:15g / mL, and stirred in a constant temperature water bath at 60°C for 2h. After the pretreatment, the remaining residue is cleaned, filtered and dried, and then added to the reactor 3.

[0018] Add potassium iodide-iodine solution in reactor 3, wherein the molar concentration ratio n(I of iodine simple substance and potassium iodide 2 ):n(I - ) is 1:10, the solid-to-liquid ratio is controlled at 1:8g / mL, immediately seal the reactor 3, start the heater 4, start timing after the temperature rises to 32°C, and turn on the CO 2 Cylinder 1 and high-press...

Embodiment 2

[0020] Such as figure 1 and figure 2 As shown, the main board and components of the waste circuit board are separated, the components are sorted and processed separately, and the main board of the circuit board is processed into pieces smaller than 1cm by a shearing machine. First, pretreat the circuit board fragments with nitric acid, and the pretreatment conditions are as follows: the solid-to-liquid ratio is 1:15g / mL, and stirred in a constant temperature water bath at 60°C for 2h. After the pretreatment, the remaining residue is cleaned, filtered and dried, and then added to the reactor 3.

[0021] Add potassium iodide-iodine solution in reactor 3, wherein the molar concentration ratio n(I of iodine simple substance and potassium iodide 2 ):n(I - ) is 1:10, the solid-to-liquid ratio is controlled at 1:8g / mL, immediately seal the reactor 3, start the heater 4, start timing after the temperature rises to 32°C, and turn on the CO 2 Cylinder 1 and high-pressure pump 2, th...

Embodiment 3

[0023] Such as figure 1 and figure 2 As shown, the main board and components of the waste circuit board are separated, the components are sorted and processed separately, and the main board of the circuit board is processed into pieces smaller than 1cm by a shearing machine. First, pretreat the circuit board fragments with nitric acid, and the pretreatment conditions are as follows: the solid-to-liquid ratio is 1:15g / mL, and stirred in a constant temperature water bath at 60°C for 2h. After the pretreatment, the remaining residue is cleaned, filtered and dried, and then added to the reactor 3.

[0024] Add potassium iodide-iodine solution in reactor 3, wherein the molar concentration ratio n(I of iodine simple substance and potassium iodide 2 ):n(I - ) is 1:10, the solid-to-liquid ratio is controlled at 1:8g / mL, immediately seal the reactor 3, start the heater 4, start timing after the temperature rises to 32°C, and turn on the CO 2 Cylinder 1 and high-pressure pump 2, th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method and device for rapidly leaching out gold in a waste circuit board. The method comprises the following steps: pre-treating the circuit board with nitric acid; adding an iodine-potassium iodide solution in a reactor, and sealing the reactor; starting a heater, opening a CO2 gas cylinder and starting a pressure pump, and introducing CO2 after pressurized into the reactor; and after reaction is finished, opening an extraction valve at the outlet formed in the bottom of the reactor, separating a leaching solution from solid phase residues, and enabling the leaching solution to enter an extracted product bottle to obtain a gold-rich solution. According to the method disclosed by the invention, on the basis of the traditional potassium iodide-iodine method, a supercritical CO2 extraction system is adopted with KI and I2 as a cosolvent, hydrogen peroxide, serving as an oxidant, is not needed, the gold leaching time is shortened to 15mins and by 16 times compared with the traditional method, and the leaching efficiency of the gold is improved to 99.9 percent.

Description

technical field [0001] The invention belongs to the field of solid waste treatment, and relates to a method and a device for quickly leaching gold from waste circuit boards. Background technique [0002] At present, electronic waste is the fastest growing solid waste, and waste circuit boards are the most important part of electronic waste. The gold content in scrap circuit boards is about 280g / t, which is much higher than that of high-quality gold concentrate (about 70g / t). Hydrometallurgy is currently the most important gold leaching technology. Among various hydrometallurgical methods, cyanidation has been the main gold leaching process for a long time, but the severe toxicity of cyanide seriously endangers the environment and human health. Therefore, some new cyanide-free gold leaching methods have been proposed. The main non-cyanide gold leaching methods include: water chlorination method, thiosulfate method, thiourea method, lime sulfur method, chlorine dioxide metho...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C22B7/00C22B11/00
CPCY02P10/20
Inventor 修福荣齐莹莹
Owner FUJIAN UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap