Manufacturing method of semi-flexible copper clad laminate

Abstract

The invention discloses a making method of a semi-flexible copper-clad plate. The method comprises the following steps: 1, melting a glass raw material, and carrying out wire drawing treatment on the molten glass raw material to form fiberglass; 2, impregnating the fiberglass in a glue solution to carry out impregnation treatment, taking out the impregnated fiberglass, carrying out drying semi-solidifying treatment, and braiding the dried semi-solidified fiberglass to form a 106 glass fiber cloth blank; 3, carrying out baking solidification on the 106 glass fiber cloth blank to form a 106 formed cloth, wherein the weight content of resin in the 106 formed cloth does not exceed 30%; 4, impregnating the 106 formed cloth in the glue solution to carry out impregnation treatment; 5, baking the impregnated 106 formed cloth in an oven to form prepregs; and 6, respectively covering the upper surface and the lower surface of each of the prepregs with a 18[mu] electrolytic copper foil, and laminating the prepregs and the 18[mu] electrolytic copper foils in a vacuum press to form the semi-flexible copper-clad plate. The semi-flexible copper-clad plate made through using the method has the advantages of stable dimension, flat surface, and improved quality and performances.

Description

technical field [0001] The invention relates to the technical field of production of semi-flexible copper-clad laminates, in particular to a method for manufacturing semi-flexible copper-clad laminates by using 106 sizing cloth. Background technique [0002] With the miniaturization and multi-function of electronic products, especially the miniaturization and high performance of consumer electronic products has become an obvious trend, which requires printed circuit boards (Printed Circuit Board, PCB) for electronic products ) to achieve high density and high performance. Under this premise, flexible printed circuit boards (Flexible Printed Circuit Board, FPCB) and rigid-flexible boards have shown advantages. These special-structured PCB boards can significantly reduce the volume occupied by electronic products and achieve dense assembly and three-dimensional assembly. [0003] At present, the reinforcing material used in the flexible copper clad laminate (FCCL) used to man...

AI Technical Summary

Problems solved by technology

[0005] (1) Due to the weaving structure of the conventional glass fiber cloth itself, its glass filaments are easily subjected to slight uneven tension to cause gluing and weft skew during the lamination process, resulting in poor dimensional stability of the glass fiber cloth, serious warping and appearance. The appearance is uneven, which further makes it easy to cause problems such as warping of the board due to extrusion deformation during the lamination process;

[0006] (2) Due to the interweaving of warp and weft yarns in the woven glass fiber cloth, gaps appear between yarns and yarns (ie, warp yarns and weft yarns, warp yarns and warp yarns, weft yarns and weft yarns). Larger and more, leading to poor impregnation of glass fiber cloth, which in turn affects the quality of semi-flexible copper clad laminates, resulting in serious ion migration (CAF) problems in PCB boards using the glass fiber cloth, resulting in unqualified PCB boards;

[0007] (3) When making thin semi-flexible copper-clad laminates, the above-mentioned defects will be magnified, which will seriously affect the quality of the product. Therefore, it is very difficult to make thin semi-flexible copper-clad laminates using existing methods

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