Substrate for flexible photoelectronic device, and preparation method thereof

A technology for optoelectronic devices and substrates, which is applied in the fields of electrical solid-state devices, semiconductor/solid-state device manufacturing, and electrical components. and other problems, to achieve the effect of improving light transmittance, improving water and oxygen barrier capacity, and improving performance

Inactive Publication Date: 2016-02-17
广州竞择微电子技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention provides a substrate for flexible optoelectronic devices and a preparation method thereof in view of the above disadvantages, which solves the problem of insufficient flexibility of the existing flexible substrate, poor water and oxygen barrier ability, poor bonding force between the flexible substrate and the conductive layer, and poor permeability. The problem of low light rate

Method used

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  • Substrate for flexible photoelectronic device, and preparation method thereof
  • Substrate for flexible photoelectronic device, and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0043] Such as figure 1 In the substrate structure shown, the flexible substrate 2 is a polyimide film doped with 0.2% cationic UV-sensitive adhesive and 10% aloe vera gel by mass ratio, and the conductive layer 1 is graphene.

[0044] The preparation method is as follows:

[0045] ① Clean the rigid substrate with a surface roughness less than 1nm first, then use detergent, acetone, deionized water, and isopropanol to perform ultrasonic cleaning, and dry it with dry nitrogen after cleaning;

[0046] ② Prepare a mixed film of polyimide, cationic UV-sensitive glue and aloe gel by spin coating on a rigid substrate, the film thickness is 5 μm, and the raw material of the cationic UV-sensitive glue includes the following components:

[0047] Epoxy resin or modified epoxy resin 85%

[0048] Thinner 10%

[0049] Cationic photoinitiator 5%;

[0050] ③ Prepare a conductive layer from graphene aqueous dispersion in ② surface spraying method, the height is 20cm, the spraying pressure...

Embodiment 2

[0056] Such as figure 1 In the substrate structure shown, the flexible substrate 2 is a polyimide film doped with 0.5% cationic UV-sensitive glue and 15% aloe vera gel by mass ratio, and the conductive layer 1 is carbon nanotubes.

[0057] The preparation method is as follows:

[0058] ① Clean the rigid substrate with a surface roughness less than 1nm first, then use detergent, acetone, deionized water, and isopropanol to perform ultrasonic cleaning, and dry it with dry nitrogen after cleaning;

[0059] ② Prepare a mixed film of polyimide, cationic UV-sensitive glue and aloe gel by spin coating on a rigid substrate, the film thickness is 20 μm, and the cationic UV-sensitive glue raw material includes the following components:

[0060] Epoxy resin or modified epoxy resin 87%

[0061] Thinner 9%

[0062] Cationic photoinitiator 4%;

[0063] ③ In ② surface spraying method, the carbon nanotube aqueous dispersion is prepared as a conductive layer, the height is 20cm, the sprayi...

Embodiment 3

[0069] Such as figure 1 In the substrate structure shown, the flexible substrate 2 is a polystyrene film doped with 2% cationic UV-sensitive glue and 23% aloe vera gel by mass ratio, and the conductive layer 1 is silver nanowires.

[0070] The preparation method is as follows:

[0071] ① Clean the rigid substrate with a surface roughness less than 1nm first, then use detergent, acetone, deionized water, and isopropanol to perform ultrasonic cleaning, and dry it with dry nitrogen after cleaning;

[0072] ② Prepare a mixed film of polystyrene, cationic UV-sensitive glue and aloe gel by spin coating on the rigid substrate, the film thickness is 60 μm, and the raw material of the cationic UV-sensitive glue includes the following components:

[0073] Epoxy resin or modified epoxy resin 89%

[0074] Thinner 8%

[0075] Cationic photoinitiator 3%;

[0076] ③ Prepare a conductive layer with silver nanowire isopropanol dispersion in ② surface spraying method, the height is 20cm, th...

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Abstract

The invention discloses a substrate for a flexible photoelectronic device, and a preparation method thereof. The substrate comprises a flexible substrate and a conducting layer, and is characterized in that the flexible substrate is a polymer film, the polymer film is doped with aloe-gel and cationoid ultraviolet-sensitive glue, wherein the raw material of the cationoid ultraviolet-sensitive glue comprises the following components: an epoxy resin or a modified epoxy resin, a diluent and a cation photoinitiator. According to the invention, through crosslinking effect of the ultraviolet-sensitive glue, the problem of not high polymer substrate flexibility and the problem of low substrate transmittance are solved, at the same time, through addition of a proper amount of the aloe-gel, the substrate flexibility can be enhanced, the capability of the substrate in obstructing water and oxygen can also be improved, and the substrate provided by the invention can be widely applied to preparation of a green environmental-friendly flexible photoelectronic device.

Description

technical field [0001] The invention relates to the field of organic optoelectronics, in particular to a substrate for a flexible optoelectronic device and a preparation method thereof. Background technique [0002] Flexible electronics and flexible optoelectronics technology is the most active research direction in the field of electronic information in the past 10 years, and it is also an important direction for the development of the electronic information industry. Flexible electronic products with ultra-light, bendable, rollable and even foldable properties, including flexible liquid crystal displays, flexible organic electroluminescent displays, flexible organic solar cells, etc., have gradually developed into the most promising high-tech industries. However, there are still some problems to be solved in this field: 1. The substrates used in flexible electronics and flexible optoelectronic devices need to meet people’s requirements for portability and lightness; Requi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/54H01L51/56C08L79/08C08L63/00C08L89/00C08J5/18
CPCC08J5/18C08L79/08C08L2203/16C08L2205/03C08J2379/08H10K85/00H10K50/80H10K71/00C08L63/00C08L89/00
Inventor 于军胜陈珉
Owner 广州竞择微电子技术有限公司
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