Cutting fluid circulating device for multi-wire sawing machine

Abstract

The invention relates to a cutting fluid circulating device for a multi-wire sawing machine, and solves the defects of no structure reasonability of a cutting fluid circulating system, generation of a lot of foams in cutting by cutting fluid and influence on the quality of silicon chips in the prior art. In the cutting fluid circulating device for the multi-wire sawing machine, an overflow port is formed in a water tank, and is communicated with a filter by an overflow pipe; the filter is communicated with a water storage barrel by a water return pipe; the overflow pipe is serially connected with a first settling barrel; a water return pipe is serially connected with a second settling barrel; cutting fluid overflowing by the overflow port is settled by the first settling barrel, and is filtered by the filter; the cutting fluid filtered by the filter is settled by the second settling barrel, and finally enters the water storage barrel for recycling; and the cutting fluid is settled, filtered and settled to obtain excellent water quality, so that the cutting fluid cannot generate a lot of foams in circulation, and the water use level of the cutting fluid circulating system is reduced.

Description

technical field [0001] The invention relates to a cutting fluid circulation device for a multi-wire cutting machine. Background technique [0002] Silicon wafer cutting machine is a necessary equipment for the production of silicon wafers, which plays the role of cutting silicon ingots. That is to say, silicon ingots are cut by a cutting machine to form silicon wafers. Therefore, a cutting machine must be used to produce silicon wafers. Due to the particularity of silicon ingots, when the cutting machine cuts silicon ingots, the cutting fluid will generate a lot of foam. In order to ensure the normal operation of the cutting machine, a large amount of water has to be added to ensure the normal operation of the cutting machine. [0003] The cutting fluid circulation system of the cutting machine in the prior art generally supplies water to several cutting machines uniformly from one water supply pipe, and then the cutting fluid after participating in the cutting is recovered...

AI Technical Summary

Problems solved by technology

[0004] The invention provides a cutting fluid circulation device for a multi-wire cutting machine, which aims to overcome the unreasonable structure of the cutting fluid circulation system in the prior art. When the cutting fluid participates in cutting, a large amount of foam will be generated, which will further affect the quality of silicon wafers.

Images