Laser and grating coupler packaging structure and method

Abstract

The invention provides a laser and grating coupler packaging structure and method. The packaging structure comprises a laser unit, a collimating lens, an isolator and a reflection prism, wherein the laser unit, the collimating lens, the isolator and the reflection prism are mounted on a silicon-based photoelectric chip. The silicon-based photoelectric chip comprises a first electrode, first and second marks, a grating coupler and a waveguide layer which are all arranged at the surface; the laser unit comprises a transitional substrate and a laser; the collimating lens comprises a first lens and a second lens, the first lens is vertical to the surface, the second lens is arranged at the surface at the position of the second mark, and thus, the grating coupler is placed in the central area of the main axis of the optical path of the second lens; and the isolator is mounted at the surface between the first lens and the second lens, so that diverging light output by the laser is collimated by the first lens, then reflected to the reflection prism through the isolator, deflected by the reflection prism for certain angle, and gathered by the second lens, and the gathering point is placed at the surface of the grating coupler. Thus, technical problems in accurate in-place packaging are solved, convenience is provided for preparation, and the yield rate is improved.

Description

technical field [0001] The invention provides a silicon photonic integrated device, in particular to provide a packaging structure of a laser and a grating coupler and a method thereof. Background technique [0002] Silicon-based monolithic integrated optoelectronic chips are currently a hot spot in international research. Silicon-based optoelectronic integration technology is to monolithically integrate optical waveguides / modulators, photodetectors, drive circuits and receiver circuits, that is, optical components It is integrated with electrical components on a chip, and all devices are manufactured using standard integrated circuit technology. Its advantages are mature manufacturing technology, low cost, and small size, and is suitable for short- and medium-distance optical communication applications such as data centers. [0003] Although silicon-based materials can be used to make most of the optical devices and electrical devices in optical fiber communication, since s...

AI Technical Summary

Problems solved by technology

However, there has not been a design that fully meets the performance requirements. Therefore, in silicon-based monolithic integrated optoelectronic chips, the relatively simple and feasible way is to use external hybrid integration of Group III and V lasers to realize the function of the light source.

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