An automatic calibration method for the coaxiality error of the pick-and-place machine nozzle based on machine vision

Abstract

The invention discloses a method for automatically calibrating the coaxiality error of the suction nozzle of a placement machine based on machine vision. The product Mark information is obtained through a CCD positioning camera, so that the suction nozzle is positioned at the position of the product; the product is sucked and then moved to the UpLook Take pictures at every other angle above the camera to obtain image information, and then fit the position information of each Mark of the material to calculate the rotation center of the mechanical axis; calculate the Mark point to the rotation of the product during the rotation process Center distance, and calculate the average value of all distances, and then subtract the calculated average value from the distance from all Mark points to the center of rotation, which is the concentricity brought by the rotation of the suction nozzle during the placement process deviation, and compensate for it. The automatic calibration method of the coaxiality error of the pick-and-place machine nozzle ensures that the concentricity of each processing is within the allowable range and the mounting accuracy is guaranteed.

Description

technical field [0001] The invention relates to the technical field of chip mounter mounting, in particular to a machine vision-based automatic calibration method for the coaxiality error of the chip mounter suction nozzle. Background technique [0002] In the production line, the placement machine is configured after the dispenser or screen printing machine. The placement machine is a device that accurately places surface mount components on a fixed position by moving the placement head. When mounting on the placement machine, it is generally necessary to install a buffer device at the nozzle to reduce the impact on the product to be mounted due to the difference in the height of the sucked product during placement. The advantage of this design is that it is low in cost. It is easy to realize, but the accuracy of the machine assembly is easily affected by the verticality of the installation and the concentricity of the suction nozzle caused by machining errors, and the cons...

AI Technical Summary

Problems solved by technology

When mounting on the placement machine, it is generally necessary to install a buffer device at the nozzle to reduce the impact on the product to be mounted due to the difference in the height of the sucked product during placement. The advantage of this design is that it is low in cost. It is easy to implement, but the accuracy of the machine after assembly is easily affected by the verticality of the installation and the concentricity of the suction nozzle caused by machining errors, and the consistency is difficult to guarantee

In addition, during the placement process of the existing placement machine, due to the fast movement speed and high frequency of use of the placement head nozzle during the work process, and the unsmooth impact will inevitably occur during the suction and placement process Therefore, after working for a long time, the mechanical positioning accuracy of the placement head is prone to large changes, which affects its placement accuracy. Users need to frequently replace the placement head and adjust the parameters of the machine, resulting in poor overall experience of the machine.