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Conductive particle and preparation method thereof, conductive adhesive and display apparatus

A technology of conductive particles and conductive adhesives, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, conductive adhesives, cable/conductor manufacturing, etc., can solve the problems of difficult processing of carbon materials and large changes in conductivity, etc. Achieve the effect of avoiding agglomeration problems and improving dispersion

Active Publication Date: 2015-12-09
BOE TECH GRP CO LTD +1
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  • Claims
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Problems solved by technology

[0005] In view of this, in order to solve the problems of the prior art, embodiments of the present invention provide a conductive particle and a preparation method thereof, a conductive adhesive, and a display device. The carbon materials used as fillers are difficult to process, and the electrical conductivity varies greatly with raw material factors such as the origin of raw materials.

Method used

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  • Conductive particle and preparation method thereof, conductive adhesive and display apparatus
  • Conductive particle and preparation method thereof, conductive adhesive and display apparatus
  • Conductive particle and preparation method thereof, conductive adhesive and display apparatus

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preparation example Construction

[0045] Embodiments of the present invention provide a figure 1 The preparation method of the conductive particle 01 shown, such as figure 2 Shown, this preparation method comprises:

[0046] S01, forming a spherical core 10;

[0047] S02, dispersing the spherical core 10 in deionized water, and adding organic polymer monomers to form a reaction solution;

[0048] S03, irradiating the reaction solution with gamma (γ) rays, so that the organic polymer monomer undergoes a polymerization reaction on the surface of the ball core 10 to form an organic polymer;

[0049] S04, separating the core 10 with the organic polymer formed on the surface from the above reaction solution to obtain the core 10 with the organic polymer formed on the surface;

[0050] S05. Carry out preoxidation and carbonization treatment sequentially on the core 10 formed with an organic polymer on the surface, so that the organic polymer forms a conductive layer 20 composed of carbon particles, so as to obta...

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Abstract

An embodiment of the invention provides a conductive particle and a preparation method thereof, a conductive adhesive and a display apparatus and relates to the display technology field. Through using the preparation method, problems that processing is difficult and conductivity changes greatly existing in a carbon material applied in the conductive adhesive in the prior art can be solved. The preparation method comprises the following steps of forming sphere kernels; dispersing the sphere kernels in deionized water and adding organic polymer monomers so as to form a reaction solution; carrying out gamma ray irradiation on the reaction solution so that the organic polymer monomers generate a polymerization reaction on sphere kernel surfaces so as to form organic polymers; separating the sphere kernels whose surfaces form the organic polymers from the reaction solution so as to obtain the sphere kernels whose surfaces form the organic polymers; successively carrying out preoxidation and carbonization treatment on the sphere kernels whose surfaces form the organic polymers so that the organic polymers form a conducting layer formed by carbon particles so as to obtain the conductive particle formed by the conducting layer and the sphere kernels. The method is used for preparing the conductive particle and the conductive adhesive including the conductive particle and manufacturing the display apparatus.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a conductive particle and a preparation method thereof, a conductive glue and a display device. Background technique [0002] Conductive adhesive is an adhesive with both electrical conductivity and bonding properties. It can connect various conductive materials together to form a conductive path between the connected conductive materials. It is widely used in the field of electronic device preparation. Conductive adhesive is usually composed of two parts: adhesive main body adhesive and conductive filler. [0003] Among them, the conductive filler mainly includes three types of materials: metal oxide, metal, and carbon-based materials. Since metal oxides generally have poor conductivity, metal or carbon-based materials are usually used. Metal conductive fillers usually use metal particle powders with low resistivity such as Au (gold), Ag (silver), Cu (copper), Ni (nickel), amo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/24H01B5/16H01B13/00C09J9/02C09J11/04
CPCC08K9/00C08K2201/001C09J9/02C09J11/08C09J1/00H01L24/29H01L2224/29005H01L2224/29099H01L2224/29693
Inventor 徐德智
Owner BOE TECH GRP CO LTD
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