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A temperature equalizing device for dissipating heat from multi-heat source devices using a soaking plate and microchannels

A technology of micro-channel and vapor chamber, which is applied in semiconductor devices, electric solid-state devices, semiconductor/solid-state device components, etc., can solve the problems of temperature gradient affecting chip stability, inability to dissipate heat evenly in electronic devices with multiple heat sources and high heat flux density, etc. , to avoid excessive heat load, ensure sealing performance, and achieve the effect of uniform distribution

Inactive Publication Date: 2018-10-23
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the problem that the existing heat dissipation device cannot uniformly dissipate heat from electronic devices with high heat flux density of multiple heat sources, and the temperature of the existing parallel microchannel rises rapidly along the flow direction during use, a large temperature gradient is formed In order to solve the problem of affecting the stability of the chip, we provide a temperature equalizing device that uses a vapor chamber and microchannels to dissipate heat from multiple heat source devices. The vapor chamber in a two-dimensional heat transfer mode is used for heat dissipation, and has a lower thermal resistance value. , the heat dissipation speed of the chip is faster; at the same time, the microchannel design of the present invention can reduce the temperature gradient, realize the uniform distribution of heat, and avoid the damage caused by the excessive local heat load of the chip; pressure drop

Method used

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  • A temperature equalizing device for dissipating heat from multi-heat source devices using a soaking plate and microchannels
  • A temperature equalizing device for dissipating heat from multi-heat source devices using a soaking plate and microchannels
  • A temperature equalizing device for dissipating heat from multi-heat source devices using a soaking plate and microchannels

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Embodiment 1

[0036] The temperature equalizing device of this embodiment adopts a vapor chamber and a microchannel to dissipate heat from a multi-heat source device, including an LTCC substrate, at least two heat sources are packaged in the LTCC substrate, and a vapor chamber is installed above the LTCC substrate, so that Microchannels with the same number as the heat source are arranged above the vapor chamber, the inlet of each microchannel communicates with an external cooling liquid source through an inlet, and the outlet of each microchannel communicates with an external liquid collection tank.

Embodiment 2

[0038] The temperature equalizing device of this embodiment adopts a vapor chamber and a microchannel to dissipate heat from a multi-heat source device, including an LTCC substrate, at least two heat sources are packaged in the LTCC substrate, and a vapor chamber is installed above the LTCC substrate, so that The top of the vapor chamber is provided with the same number of micro-channels as the number of heat sources, the inlet of each micro-channel communicates with an external cooling liquid source through an inlet, and the outlet of each micro-channel communicates with an external liquid collection tank; The channels have the same or different number of runners.

Embodiment 3

[0040] The temperature equalizing device of this embodiment adopts a vapor chamber and a microchannel to dissipate heat from a multi-heat source device, including an LTCC substrate, at least two heat sources are packaged in the LTCC substrate, and a vapor chamber is installed above the LTCC substrate, so that The top of the vapor chamber is provided with the same number of micro-channels as the number of heat sources, the inlet of each micro-channel communicates with an external cooling liquid source through an inlet, and the outlet of each micro-channel communicates with an external liquid collection tank; The channels have the same or different numbers of channels; the channels of the microchannels are arranged side by side.

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Abstract

The invention discloses a temperature equalizing device adopting a vapor chamber and microchannels for radiating a multi-heat-source device. The temperature equalizing device is used for solving the problems that the existing radiating device cannot be used for radiating multi-heat-source high heat flux electrical devices evenly, and the stability of a chip is affected due to a high temperature gradient formed since temperature rises quickly along flow directions when the existing parallel microchannels are in use. The temperature equalizing device comprises an LTCC substrate, wherein at least two heat sources are packaged inside the LTCC substrate, the vapor chamber is installed on the LTCC substrate, the microchannels with the same number as the heat sources are formed above the vapor chamber, an entrance of each microchannel is communicated with an external cooling liquid source through an inlet, and an exit of each microchannel is communicated with an external liquid collecting box.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation devices based on LTCC multi-chip components, and specifically discloses a temperature equalization device that uses a soaking plate and microchannels to dissipate heat from multiple heat source devices, and is used for dissipating heat from devices with multiple heat sources and high heat flux density. Background technique [0002] Modern microelectronic chip technology is developing rapidly. Multi-chip module (MCM) is a microelectronic packaging technology developed on the basis of hybrid integrated circuits, which has more functions, higher performance and smaller volume. Ceramic multi-chip component (MCM-C), as an advanced stage of thick film HIC development and a practical multi-chip component, has many significant advantages such as many interconnection layers, high integration density, excellent electrical performance, and low manufacturing cost. more and more widely used. The high...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L23/473H01L23/427
Inventor 徐尚龙杨丽丽胡兴隆李悦汤文杰
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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