Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Tin paste printing screen plate cleaning method based on infrared high-temperature radiation

A technology of solder paste printing and high-temperature radiation, which is applied in the field of cleaning of solder paste printing screens based on infrared high-temperature radiation, can solve the problems of poor cleaning quality, low cleaning efficiency, and unclean cleaning, etc., so as to prolong the service life and avoid wear and tear , Guarantee the effect of cleaning quality

Inactive Publication Date: 2015-11-25
SUZHOU ENOUXI INTELLIGENT TECH CO LTD
View PDF9 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Solder paste printing stencil cleaning is a meticulous job, and operators without experience and patience cannot clean it. Usually, the staff cleans it directly with detergent, then rinses it with water, and finally wipes it dry with a cloth. This cleaning method Often lead to solder paste residue in the holes of the solder paste printing screen, low cleaning efficiency and poor cleaning quality

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0018] Embodiment: A method for cleaning a solder paste printing screen based on infrared high-temperature radiation, comprising the following steps:

[0019] Step 1: Use a squeegee to shave the solder paste printing screen, shave at least 3 times, and keep the same shaving direction each time;

[0020] Step 2: Put the shaved solder paste printing screen into the reflow oven for high-temperature cleaning and low-temperature solidification;

[0021] Step 3: Place the solder paste printing screen after the reflow oven is completed into the infrared high-temperature baking machine for infrared high-temperature radiation cleaning;

[0022] Step 4: Take the solder paste printing stencil cleaned by infrared high-temperature radiation out of the baking machine, cool it naturally and store it in a sealed packaging bag.

[0023] The scraper described in step one is a soft rubber scraper.

[0024] The reflow oven described in step 2 includes a heating zone, a constant temperature zone...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a tin paste printing screen plate cleaning method based on infrared high-temperature radiation. The method comprises the following steps: (1) a scraper is used for scraping a tin paste printing screen plate by at least 3 times; and the same scraping direction is kept in each scraping; (2) the scraped tin paste printing screen plate is put in a reflow welding furnace for high-temperature cleaning and low-temperature condensation; (3) the tin paste printing screen plate is put in an infrared high-temperature roaster for infrared high-temperature radiation cleaning after the operation in the reflow welding furnace; and (4) the tin paste printing screen plate is taken out from the roaster for natural cooling after the infrared high-temperature radiation cleaning, and is put in a seal packing bag for storage. The method can improve the cleaning efficiency, guarantees the cleaning quality, and prevents the use of cleaning agents.

Description

technical field [0001] The invention relates to a method for cleaning a printing screen, in particular to a method for cleaning a solder paste printing screen based on infrared high-temperature radiation. Background technique [0002] Solder paste printing stencil cleaning is a meticulous job, and operators without experience and patience cannot clean it. Usually, the staff cleans it directly with detergent, then rinses it with water, and finally wipes it dry with a cloth. This cleaning method It often leads to solder paste residue in the holes of the solder paste printing screen, low cleaning efficiency and poor cleaning quality. [0003] In view of the above-mentioned defects, the designers are actively researching and innovating in order to create a method for cleaning solder paste printing screens based on infrared high-temperature radiation, so that it has more industrial value. Contents of the invention [0004] In order to solve the above-mentioned technical proble...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B41F35/00
Inventor 杨文杰
Owner SUZHOU ENOUXI INTELLIGENT TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com