Low-melting-point aromatic-nitrile-group resin monomer and preparation thereof and aromatic-nitrile-group polymer and preparation method thereof

Abstract

The invention discloses a low-melting-pint aromatic-nitrile-group resin monomer and a preparation method thereof and an aromatic-nitrile-group polymer and a preparation method thereof. Under the condition of ensuring that thermal stability of resin is not affected greatly, the purposes of reducing a resin melting point, widening a resin processing window, lowering resin curing temperature and lowering the resin cost are achieved through changing the structure of the resin monomer. The aromatic-nitrile-group resin monomer is a bisphenol A type aromatic-nitrile-group resin monomer containing aromatic ether nitrile chain segments, has the advantages of a low melting point, a wide processing window, a low curing temperature and others, has better processing performance and keeps the good thermal stability, mechanical performance and flame resistance of aromatic-nitrile-group resin; meanwhile, side nitrile groups are introduced to increase the number of crosslinking points in the process of resin curing, finally, the effect of increasing crosslinking density is achieved, and the thermal stability of the resin is further improved.

Description

technical field [0001] The invention belongs to the technical field of organic polymer materials, and relates to an aromatic nitrile-based resin monomer, polymer and a preparation method thereof with a low melting point and a wide processing window containing an aromatic ether nitrile chain segment. Background technique [0002] Aromatic nitrile resin is a new type of high temperature resistant thermosetting resin developed by Keller and his team at the US Naval Laboratory in the 1980s. Due to the good thermal stability and mechanical properties of the fully cured aromatic nitrile-based polymers, as well as excellent thermo-oxidative stability, flame retardancy and good moisture resistance, this type of resin is used in aerospace, ships, micro It has a wide range of uses in the fields of electronics and machinery manufacturing, and the most typical structures are biphenyl-type bis-phthalonitrile and bisphenol A-type bis-phthalonitrile. However, the melting temperature of pu...

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Problems solved by technology

However, the melting temperature of pure bisphenol A aromatic nitrile resin (monomer) is as high as 200°C, which is only 20°C lower than its curing reaction temperature, which makes its processing temperature window narrow (~20°C), and its thermal curing reaction It is also relatively slow. If it is only thermally cured, it needs to be treated at 280°C for nearly a hundred hours to observe the obvious gel phenomenon, and the main synthetic raw material of aromatic nitrile resin is 4-nitrophthalonitrile. The proportion of 4-nitrophthalonitrile in the base resin is relatively large, which makes the cost of traditional aromatic nitrile-based resins relatively high

The high cost has greatly restricted the popularization and application of ordinary new high-temperature-resistant aromatic nitrile resins, so it is necessary to find a new structure to reduce the production cost of aromatic nitrile resins and reduce the melting point of the resin.

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