Transverse current regulator diode and manufacturing method thereof
A technology of constant current diode and manufacturing method, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of high voltage and low saturation, and achieve low pinch-off voltage, constant current, and easy pinch-off. Effect
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Embodiment 1
[0038] Such as Figure 9 As shown, the structure of this example is mainly, in such as figure 2 On the basis of the shown structure of the present invention, a P-type lightly doped region 15 is added in the second N-type well region 14; the P-type lightly doped region 15 is located in the third N-type heavily doped region 13 and the fourth Between the N-type heavily doped regions 3 , the upper surface has a metal cathode connected to the cathode on the upper surface of the third N-type heavily doped region 13 . The added resistance structure of this structure has a voltage drop at both ends of the resistance during the working process of the device, which makes it easier to pinch off the device, that is, the voltage at which the device is saturated can be reduced. As the voltage at both ends of the device increases, the voltage at both ends of the resistor introduced in this patent increases, which can increase the constant flow rate of the current, and at the same time, the...
Embodiment 2
[0040] Such as Figure 10 As shown, the structure of this example is mainly, and figure 2 The difference in the shown structure is that a passivation layer 13 is added on the upper surface of the oxide layer 2, and a polycrystalline resistor 15 is set in the passivation layer 13 to replace the second N-type well region 14; the polycrystalline resistor 15 is far away from the first N-type well region. One side of the upper surface of the N-type well region 8 has a metal cathode, and the other side has a metal electrode connected to the upper surface of the first N-type heavily doped region 4; this example is another form of increasing resistance, wherein example 1 adopts Well resistor, this example adopts polycrystalline resistor. Using this example, in addition to the advantages of Example 1, it also has better temperature characteristics of polycrystalline resistor.
Embodiment 3
[0042] Such as Figure 11 As shown, the structure of this example is a single-layer metal structure on the basis of Example 2. The polycrystalline resistor is deposited on the pre-oxidized layer 16, and the passivation layer 2 is deposited on this basis, and then the through hole is formed to deposit metal. In addition to the advantages of Example 2, the use of this example can reduce the number of process steps, reduce the number of mask versions, and save costs by using a single layer of metal.
[0043] The invention provides a method for manufacturing a lateral constant current diode, which is characterized in that it comprises the following steps:
[0044] Step 1: Implanting N-type semiconductor impurities into the upper layer of the P-type substrate 9 by using an ion implantation process, and forming a first N-type well region 8 and a second N-type well region 14 on both sides of the upper layer of the P-type substrate 9;
[0045] Step 2: Implanting P-type semiconductor...
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