Intelligent power module and intelligent power module manufacturing method

Abstract

The invention is suitable for the electronic device manufacturing technology, and provides an intelligent power module and an intelligent power module manufacturing method. The intelligent power module comprises a substrate, a circuit wiring layer, circuit elements and a metal wire, wherein the substrate comprises a first surface and a second surface which is opposite to the first surface; the first surface forms gauffers; the second surface is covered by an insulation layer; the substrate is a paper-based radiator; the circuit wiring layer is formed on the surface of the insulation layer; the circuit elements are arranged on the corresponding positions of the circuit wiring layer; and the metal wire is connected with the circuit wiring layer and the circuit elements. As the back of the intelligent power module is provided with radiation gauffers so that the radiation area is greatly increased and the insulation layer can satisfy the radiation requirement of power elements without using high thermal conductivity materials. As the radiation structure is made of paper-based materials, the weight of the radiation structure is light and the total weight of the intelligent power module is reduced, thus being convenient for long-distance transport and assembling for workers. As the module is provided with a radiator, during the application process, no radiators are required to be connected with the outside of the module so that the application difficulty and the application cost are reduced and assembling quality is improved.

Description

technical field [0001] The invention belongs to the field of electronic device manufacturing technology, and in particular relates to an intelligent power module and a manufacturing method thereof. Background technique [0002] Intelligent Power Module (Intelligent Power Module, IPM) is a power drive product that combines power electronics and integrated circuit technology. IPM integrates power switching devices and high-voltage drive circuits, and has built-in fault detection circuits such as overvoltage, overcurrent and overheating. On the one hand, the IPM receives the control signal from the MCU to drive the subsequent circuits to work, and on the other hand, sends the system status detection signal back to the MCU. Compared with the traditional discrete solution, IPM wins more and more markets with its advantages of high integration and high reliability. It is especially suitable for frequency converters and various inverter power supplies for driving motors. An ideal...

AI Technical Summary

Problems solved by technology

[0003] Because the smart power module generally works in a high-temperature environment, and the power device in the smart power module will emit a lot of heat when it is working, resulting in a high junction temperature of the power device. Although the circuit substrate has a heat dissipation effect, because the insulating layer The presence of , resulting in a higher overall thermal resistance of the intelligent power module

[0004] The long-term operation of the intelligent power module at high temperature will seriously reduce the service life and affect the stability of performance. In extreme cases, it will cause the intelligent power module to explode out of control due to the overheating of the internal components during the working process, causing casualties and property loss

[0005] Selecting a high thermal conductivity insulating layer and adding a heat sink is the main method to solve the heat dissipation problem of the current intelligent power module; however, the cost of the high thermal conductivity insulating layer is very high on the one hand, and on the other hand, the hardness of the high thermal conductivity insulating layer is very high due to the use of a large amount of impurities. This increases the manufacturing difficulty of the smart power module; if the heat sink is placed inside the smart power module, the power components are mounted on the heat sink, on the one hand, it will increase the cost of raw materials, and on the other hand, the process difficulty of the smart power module will be increased; if Adding a radiator outside the intelligent power module, and mounting the radiator on the back of the intelligent power module, on the one hand increases the application cost, and on the other hand increases the difficulty of assembly, which creates difficulties for the application and promotion of the intelligent power module, which is not conducive to the intelligent power module Popularity in civilian occasions

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