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Ceramic glass glaze slurry and ceramic capacitor manufactured by using same

A glass glaze, capacitor technology, applied in the direction of fixed capacitor dielectric, fixed capacitor components, etc., can solve the problems of increased direct cost and use cost, abnormal increase, increased product thickness, etc. Strength, the effect of improving the electrical strength

Active Publication Date: 2015-11-11
无锡隆傲电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, it is not difficult to see: firstly, the substantial increase in product thickness not only greatly increases the product volume, but also greatly increases the direct cost and use cost; secondly, due to the substantial increase in product volume, the resulting Various defects increase by orders of magnitude, leading to an increase in the probability of abnormalities in the product life test

Method used

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  • Ceramic glass glaze slurry and ceramic capacitor manufactured by using same
  • Ceramic glass glaze slurry and ceramic capacitor manufactured by using same
  • Ceramic glass glaze slurry and ceramic capacitor manufactured by using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Weigh SnO 2 Powder 792g and Sb 2 o 3 208g of powder, add water and put it into the grinding equipment to grind for 12 hours, put the water-containing powder obtained by grinding into an oven to dry, then put the powder in a synthesis container, and put it in a high-temperature furnace with a temperature of 1120-1180°C for 2 hours. Synthesize, and pass through a 120-mesh sieve to obtain ceramic powder. Weigh again PbO powder 1386g, B 2 o 3 Powder 189g and SiO 2 Put 525g of powder into the mixing equipment for dry mixing for 7.5-8.5 hours, put the mixed material into a melting container, put it into a high-temperature furnace with a temperature of 1210-1250°C for melting, and keep it warm for 0.5 hours to obtain molten glass The molten glass liquid is quickly taken out of the furnace and poured out for cooling or poured into the liquid and quenched to form glass particles, then the glass particles are added to water and placed in the grinding equipment for grinding f...

Embodiment 2

[0034] Weigh SnO 2 Powder 915g and Sb 2 o 3 Add 85g of powder, add water and put it into the grinding equipment to grind for 12 hours, put the water-containing powder obtained by grinding into an oven to dry, then put the powder in a synthesis container, and put it in a high-temperature furnace with a temperature of 1120-1180°C for 2 hours. Synthesize, and pass through a 120-mesh sieve to obtain ceramic powder. Weigh again PbO powder 2404g, B 2 o 3 Powder 84g and SiO 2 Put 308g of powder into the mixing equipment for dry mixing for 7.5-8.5 hours, put the mixed material into a melting container, put it into a high-temperature furnace with a temperature of 1210-1250°C for melting, and keep it warm for 0.5 hours to obtain molten glass The molten glass liquid is quickly taken out of the furnace and poured out for cooling or poured into the liquid and quenched to form glass particles, then the glass particles are added to water and placed in the grinding equipment for grinding...

Embodiment 3

[0036] Weigh SnO 2 Powder 850g and Sb 2 o 3 Add 150g of powder, add water and put it into the grinding equipment for grinding for 12 hours, put the water-containing powder obtained by grinding into an oven to dry, then put the powder in a synthesis container, and put it in a high-temperature furnace with a temperature of 1120-1180°C for 2 hours. Synthesize, and pass through a 120-mesh sieve to obtain ceramic powder. Weigh again PbO powder 1875g, B 2 o 3 Powder 125g and SiO 2Put 500g of powder into the mixing equipment for dry mixing for 7.5-8.5 hours, put the mixed material into a melting container, put it into a high-temperature furnace with a temperature of 1210-1250°C for melting, and keep it warm for 0.5 hours to obtain molten glass The molten glass liquid is quickly taken out of the furnace and poured out for cooling or poured into the liquid and quenched to form glass particles, then the glass particles are added to water and placed in the grinding equipment for gri...

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Abstract

The invention discloses semiconductor glass glaze slurry capable of remarkably improving the annihilation and breakdown properties of an ultrahigh pressure ceramic capacitor as well as a preparation method and a using method of the semiconductor glass glaze slurry. The semiconductor glass glaze slurry comprises ceramic powder, glass glaze powder, terpilenol and ethyl cellulose, wherein the glass glaze powder is 2.1-2.8 times of the ceramic powder by weight; terpilenol is 28-31% of the glass glaze powder by weight; ethyl cellulose is 5-6% of the glass glaze powder by weight; the ceramic powder is prepared from 79.2-91.5 wt% of SnO2 powder and 8.5-20.8 wt% of Sb2O3 through sintering, grinding and screening; the glass glaze powder is prepared from 66-86 wt% of PbO powder, 3-9 wt% of B2O3 powder and 11-25 wt% of SiO2 powder through sintering, grinding and screening. A process for manufacturing a high pressure ceramic capacitor comprises the step of coating and fritting with the semiconductor glass glaze slurry; after the high pressure ceramic capacitor is coated and fritted with the semiconductor glass glaze slurry, the electric breakdown intensity of the high pressure ceramic capacitor can be remarkably improved.

Description

technical field [0001] The invention relates to a semiconductor glass glaze slurry, a high-voltage ceramic capacitor using the semiconductor glass glaze slurry, and a method for manufacturing a high-voltage ceramic capacitor. Background technique [0002] At present, the anti-electrical breakdown field strength of existing domestic high-voltage and ultra-high-voltage ceramic capacitors (electrical breakdown field strength = breakdown voltage / product thickness) is 3-6KVDC / mm, and it is: the thinner the product, the better the anti-electrical breakdown field strength. The lower the field strength. The reason is mainly that under the premise that the product formula and preparation process are normal, the only effective way to increase the breakdown field strength of the product is to greatly increase the thickness of the product. [0003] However, from the failure products of the above-mentioned products after the electric breakdown field strength test, it is easy to find tha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C8/00H01G4/12
Inventor 吴纪梁吴頔居涌
Owner 无锡隆傲电子有限公司
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