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LED-UV photo-curing solder resist ink and preparation method thereof

A solder resist ink and photocuring technology, which is applied in inks, household utensils, applications, etc., can solve the problems of slow curing speed, poor anti-adhesion performance, and limited popularization and application, and achieve fast curing speed and good anti-adhesion performance.

Active Publication Date: 2015-09-30
FOSHAN 3Q ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, directly applying LED-UV light sources to traditional solder resist inks for photocuring still has defects such as slow curing speed, difficult drying, and poor anti-blocking performance, which does not meet the high-speed printing requirements of printed circuit boards; and traditional solder resist inks The photoinitiator in the photoinitiator has poor absorption at the emission wavelength of LED-UV, therefore, it limits the popularization and application of LED-UV light curing in solder resist ink

Method used

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  • LED-UV photo-curing solder resist ink and preparation method thereof
  • LED-UV photo-curing solder resist ink and preparation method thereof
  • LED-UV photo-curing solder resist ink and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Embodiment 1: LED-UV photocurable solder resist ink of the present invention

[0032] Weigh each component according to the following proportions:

[0033]

[0034]

[0035] Wherein, the vinyl ether content in the ethylenediamine-modified epoxy acrylate resin is 0.8mmol / g, and the acrylate content is 2.5mmol / g; the vinyl ether content in the propylenediamine-modified polyacrylate acrylate resin It is 3 mmol / g, and the acrylate content is 1 mmol / g.

[0036] Put the amine-modified acrylate resin, active monomer, photoinitiator, polymer organic wax powder, dispersant, pigment and filler into the dispersion bucket in proportion, and disperse at a speed of 1000-1500rpm with a high-speed disperser for 1-2 Mix the raw materials evenly; use a three-roll mill to fully grind the dispersed raw materials to a fineness of 5-10 μm; add leveling agents, defoamers, and rheological additives to the ground raw materials. A high-speed disperser disperses for 1-2 hours at a rotatio...

Embodiment 2

[0037] Embodiment 2: LED-UV photocurable solder resist ink of the present invention

[0038] Weigh each component according to the following proportions:

[0039]

[0040]

[0041] Wherein, the vinyl ether content in the ethylenediamine modified epoxy acrylate resin is 1.4mmol / g, the acrylate content is 2.2mmol / g; The vinyl ether content in the butanediamine modified polyurethane acrylate resin is 2.8 mmol / g, the acrylate content is 1.3mmol / g; the vinyl ether content in the butanediamine modified polyester acrylate resin is 0.8mmol / g, and the acrylate content is 2.5mmol / g.

[0042] Put the amine-modified acrylate resin, active monomer, photoinitiator, polymer organic wax powder, dispersant, pigment and filler into the dispersion bucket in proportion, and disperse at a speed of 1000-1500rpm with a high-speed disperser for 1-2 Mix the raw materials evenly; use a three-roll mill to fully grind the dispersed raw materials to a fineness of 5-10 μm; add leveling agents, defoa...

Embodiment 3

[0043] Embodiment 3: LED-UV photocurable solder resist ink of the present invention

[0044] Weigh each component according to the following proportions:

[0045]

[0046]

[0047] Wherein, the vinyl ether content in the propylenediamine-modified epoxy acrylate resin is 2.5 mmol / g, and the acrylate content is 3.0 mmol / g.

[0048] Put the amine-modified acrylate resin, active monomer, photoinitiator, polymer organic wax powder, dispersant, pigment and filler into the dispersion bucket in proportion, and disperse at a speed of 1000-1500rpm with a high-speed disperser for 1-2 Mix the raw materials evenly; use a three-roll mill to fully grind the dispersed raw materials to a fineness of 5-10 μm; add leveling agents, defoamers, and rheological additives to the ground raw materials. A high-speed disperser disperses for 1-2 hours at a rotational speed of 500-1000 rpm to uniformly mix the raw materials, and then filters to obtain the LED-UV photocurable solder resist ink of the...

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Abstract

The invention discloses LED-UV photo-curing solder resist ink. The LED-UV photo-curing solder resist ink comprises, by weight, 20-50% of amine modified acrylate resin, 10-45% of activated monomers, 5-15% of photoinitiator and 0.1-1% of macromolecular organic wax powder. The LED-UV photo-curing solder resist ink can be photo-cured through an LED-UV light source, has the advantages of being high in curing speed and good in adhesion preventing performance and can meet the high-speed printing requirement of a printed circuit board.

Description

technical field [0001] The invention relates to an ultraviolet light-curable solder resist ink and a preparation method thereof, in particular to an LED-UV light-curable solder resist ink and a preparation method thereof. Background technique [0002] With the development of social economy and digital electronic products, solder resist inks for printed circuit boards show rapid growth. Traditional solder resist inks are usually composed of polymerized monomers, photoinitiators, polymerization inhibitors and other components, which can be quickly cured under the action of ultraviolet (UV) light, thereby forming a solder resist protective layer on the surface of the printed circuit board. UV curing technology is known as "5E" technology, which has the advantages of environmental protection, energy saving, short drying time, good gloss, and wide application range. However, the traditional UV high-pressure mercury lamps have short lifespan (usually only 1000-2000 hours), high p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/101C09D11/107
CPCC09D11/101C09D11/107
Inventor 刘继强罗启权姚永平
Owner FOSHAN 3Q ELECTRONICS MATERIALS
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