Semiconductor device forming method
A semiconductor and device technology, which is applied in the field of semiconductor device formation, can solve problems such as easy holes, degradation of semiconductor device quality and reliability, etc.
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[0032] As mentioned in the background, in the formation process of existing semiconductor devices, there is a problem that plugs are prone to overhang in each stacked structure.
[0033] After research, it was found that the reason for the overhang phenomenon is that after the via holes are formed in the stacked structure (including the etch stop layer, the first low-K dielectric layer, the second low-K dielectric layer and the hard mask layer), it is necessary to The through holes are cleaned by using an acid solution, that is, the through holes are subjected to a pickling process. During the pickling process, the acid solution has a certain etching effect on the first low-K dielectric layer, the second low-K dielectric layer and the hard mask layer, and the acid solution has a certain etching effect on the first low-K dielectric layer and the second low-K dielectric layer. and the etching rate of the hard mask layer increase sequentially, resulting in that after cleaning, th...
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