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Module box for modular data center

A data center and modular technology, applied in the direction of cooling/ventilation/heating transformation, can solve the problems of poor air circulation, poor heat exchange energy efficiency, etc., and achieve the effect of smooth air flow, convenient operation, and ample space

Inactive Publication Date: 2015-09-02
GUANGDONG HIWAVE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Therefore, the technical problem to be solved by the present invention lies in the technical problem of poor air circulation in the modular container used in the modular data center of the prior art, resulting in poor heat exchange energy efficiency, thereby providing a container with good air circulation and high heat exchange energy efficiency. Module enclosures for modular data centers

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  • Module box for modular data center
  • Module box for modular data center
  • Module box for modular data center

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Embodiment Construction

[0028] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, ...

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Abstract

The invention provides a module box for a modular data center, comprising a shell (1), and cabinets (101) and heat absorption devices (102) arranged inside the shell (1). Each cabinet (101) has a cold air inlet (101a) and a hot air outlet (101b). Each heat absorption device (102) has a hot air inlet (102a) and a cold air outlet (102b). The cabinets (101) and the heat absorption devices (102) are arranged side by side, the air inlet and outlet direction of the cabinets (101) is parallel to the air inlet and outlet direction of the heat absorption devices (102), and the airflow direction of the cabinets (101) is opposite to the air flow direction of the heat absorption devices (102), so that annular circulating airflow sequentially passing the hot air outlets (101b) of the cabinets (101), the hot air inlets (102a) of the heat absorption devices (102), the cold air outlets (102b) of the heat absorption devices (102) and the cold air inlets (101a) of the cabinets (101) is formed. The airflow inside the module box is smooth, and the heat exchange efficiency is high.

Description

technical field [0001] The invention relates to the technical field of modular data centers, in particular to a modular box body for modular data centers. Background technique [0002] At present, as the equipment density and power in the computer room continue to increase, the traditional civil engineering data computer room cannot be expanded, resulting in the continuous increase in the cost of building and operating the data center for customers. In order to solve the problems of energy efficiency and on-demand deployment of data centers, modular data centers came into being. [0003] In recent years, data centers have developed towards ultra-large, ultra-high-density, and modularization. Among them, one of the main types of large-scale data center modularization is containerized modular data center, that is, server cabinets (hereinafter referred to as cabinets), air-conditioning equipment, battery wiring, lighting equipment, etc. are loaded into containers, which usuall...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 刘安全郎铁军李福水黎祥松
Owner GUANGDONG HIWAVE TECH
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