Schottky diode and manufacturing method thereof
A technology of Schottky diode and manufacturing method, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of low forward turn-on voltage, small on-resistance, and high breakdown voltage, and achieve forward turn-on The effect of low voltage, low on-resistance and high breakdown voltage
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Embodiment 1
[0059] image 3 is a schematic cross-sectional view of the Schottky diode provided by Embodiment 1 of the present invention. Such as image 3 shown, the Schottky diode consists of:
[0060] Substrate 1. Among them, the material of the substrate 1 can be silicon carbide, silicon nitride, silicon, sapphire, aluminum nitride, gallium nitride, SOI (silicon-on-insulator, Silicon-On-Insulator) or other epitaxial growth III- Substrate material for Group V nitrides. Among them, SOI technology introduces a buried oxide layer between the top silicon and the back substrate.
[0061] Preferably, a nucleation layer 2 and a buffer layer 3 are sequentially deposited on the substrate 1 . Among them, the material of the nucleation layer 2 can be aluminum nitride, gallium nitride or other III-V nitrides; the material of the buffer layer 3 can be non-doped aluminum nitride, gallium nitride, aluminum gallium nitride or other III - Group V nitrides.
[0062] The first semiconductor layer 4 ...
Embodiment 2
[0073] Figure 6 is a schematic cross-sectional view of the Schottky diode provided by Embodiment 2 of the present invention. Such as Figure 6 As shown, the difference from the Schottky diode provided in Embodiment 1 is that the high work function anode 10 of the Schottky diode provided in Embodiment 2 extends to the upper surface of the first passivation dielectric layer 7 to form an anode field board structure.
[0074] Compared with the Schottky diode provided in Embodiment 1 of the present invention, the Schottky diode provided in Embodiment 2 of the present invention has an anode field plate structure, which can further reduce the peak electric field at the edge of the anode, thereby reducing the Schottky junction Leakage.
Embodiment 3
[0076] Figure 7 is a schematic cross-sectional view of the Schottky diode provided in Embodiment 3 of the present invention. Such as Figure 7 As shown, the difference from the Schottky diode provided in Embodiment 2 is that the Schottky diode provided in Embodiment 3 also includes:
[0077] The field plate groove in the first passivation medium layer 7 is located under the high work function anode 10 , the bottom of the field plate groove is located on the upper surface of the second semiconductor layer 5 , and the high work function anode 10 covers the field plate groove. Wherein, the shape of the side surface of the field plate groove section is: straight line, broken line or arc; the angle between any side surface of the field plate groove and the bottom surface of the field plate groove is: right angle, obtuse angle or acute angle.
[0078] Compared with the Schottky diode provided in Embodiment 2 of the present invention, the anode structure of the Schottky diode prov...
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