Production method for reducing pinhole short circuit through photoresist insulation according to BM technology

Abstract

The invention discloses a production method for reducing pinhole short circuit through photoresist insulation according to the BM technology. The method comprises the following steps: creating the ITO pattern of an OGS touch screen on a glass substrate in advance according to the conventional yellow light technology and waiting for BM screen printing; conducting blade coating on a BM according to the blade coating screen printing technology, and then putting the treated BM into an oven for baking; conducting screen printing on the BM to form a negative photoresist insulation layer, and then putting the BM with the negative photoresist insulation layer into the oven for baking; carrying out screen printing of via hole carbon paste, and then putting the BM with the via hole carbon paste in the oven for baking; under a yellow light condition, carrying out screen printing and silver paste exposure, and putting the BM with exposed silver paste into the oven for baking; carrying out screen printing to obtain a mirror surface silver icon, carrying out final screen printing of black printing ink, and putting the BM with the black printing ink into the oven for baking; attaching a protecting film on the baked BM. The method has the advantages that the problem of failure of mass production of OGS caused by pinhole short circuit leading poor yield is solved fundamentally; the production efficiency is improved; the labor cost is reduced; the long-lasting problems of high production cost and low yield of an OGS production line are solved.

Description

Technical field [0001] The present invention mainly relates to the manufacturing field of OGS touch screens, and in particular to a manufacturing method for reducing pinhole short circuits by BM process photoresist insulation. Background technique [0002] The original technology directly uses silk screen printing on the 400mm*500mm original glass with the pattern in the production process to realize the size of the OD and VA area of ​​the fixed-size touch screen. It is difficult to adjust the BM while screen printing due to equipment and other issues. The bubbles appearing during the silk printing process are completely avoided, which will cause a short circuit between the silver paste on the silk screen and the filling block of the ITO edge below or a short circuit to the ground. (It is often used to reduce the occurrence of defects by fully inspecting the CCD lens). [0003] According to the existing BM process, during the BM squeegee screen printing operation, due to the lack ...

AI Technical Summary

Problems solved by technology

[0003] According to the existing BM process, in the process of BM squeegee coating and silk screen printing, due to factors such as lack of vacuum equipment, many tiny pinholes will be generated when squeegee coating BM, which will short-circuit the ITO filling block and silver paste on the substrate, and finally As a result, the efficiency of the production line is not high, and the yield rate cannot be improved. The most important thing is that the product cannot be repaired and reworked for reuse after the silk screen printing is completed, which leads to low efficiency of BM scraping and silk screen printing, resulting in a large number of defects and the production line cannot be normally followed. Process operation efficiency is also low

[0004] Disadvantages: The screen printing machine equipment is consumed during the screen printing process, and the yield rate is not high. The maximum efficiency affects the production progress (it is the bottleneck of the entire production process), and the product enters the next process, and there will be a lot of instability flowing to the next process. waste more material