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Method for producing substrate for power modules

A technology of a power module and a manufacturing method, which is applied in the field of manufacturing substrates for power modules, can solve problems such as increased peeling of the bonding interface between a ceramic substrate and a heat dissipation layer, and achieve the effects of high bonding reliability and corrosion inhibition

Active Publication Date: 2015-07-29
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Moreover, when soldering is performed using flux between the heat dissipation layer and the heat sink, since the flux has the effect of removing the oxide film, the oxide film at the periphery of the joint interfac

Method used

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  • Method for producing substrate for power modules
  • Method for producing substrate for power modules
  • Method for producing substrate for power modules

Examples

Experimental program
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Example Embodiment

[0043] Example

[0044] In order to confirm the effect of the manufacturing method by the power module board|substrate demonstrated above, the experiment was performed.

[0045] First, ceramic substrates made of AlN of 30 mm square were prepared as samples a to g. Among them, the ceramic substrates of the samples b to g were subjected to heat treatment at 860° C. for 30 minutes, assuming that they were bonded by active metal brazing. Then, among the samples b to g to which the heat treatment was applied, the samples c to g were surface-treated with an acid as described below. The thickness of each oxide film in the samples a to g after each treatment was measured.

[0046] a: No heat treatment

[0047] b: heat treatment only

[0048] c: After heat treatment, immersion in 18% by mass hydrochloric acid for 2.5 minutes

[0049] d: After heat treatment, immersed in 18% by mass hydrochloric acid for 5 minutes

[0050] e: After heat treatment, immersion in 18% by mass hydrochl...

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Abstract

To suppress separation between a ceramic substrate and a heat dissipation layer at the time when a heat sink is joined. A method for producing a substrate (10) for power modules, said substrate (10) being obtained by joining a circuit layer (12) formed of copper to one surface of a ceramic substrate (11) and joining a heat dissipation layer (13) formed of aluminum to the other surface of the ceramic substrate (11), which comprises: a circuit layer joining step wherein the circuit layer (12) is joined to the ceramic substrate (11) by brazing; a surface treatment step wherein the oxide film thickness of the other surface of the ceramic substrate (11) is set to 3.2 nm or less at least in a portion around the region at which the ceramic substrate (11) is to be joined with the heat dissipation layer (13) after the circuit layer joining step; and a heat dissipation layer joining step wherein the heat dissipation layer (13) is joined to the other surface of the ceramic substrate (11) by brazing after the surface treatment step.

Description

technical field [0001] The present invention relates to a method of manufacturing a substrate for a power module used in a semiconductor device that controls large current and high voltage. [0002] This application claims priority based on Japanese Patent Application No. 2012-275157 for which it applied on December 17, 2012, and uses the content here. Background technique [0003] Conventional power module substrates are known in which a metal plate serving as a circuit layer is laminated on one surface of a ceramic substrate, and a metal plate serving as a heat dissipation layer is laminated on the other surface of the ceramic substrate. Then, electronic components such as semiconductor chips are soldered to the circuit layer, and a heat sink is bonded to the heat dissipation layer. [0004] In such substrates for power modules, copper, which has excellent electrical characteristics, may be used for the metal plate serving as the circuit layer, and aluminum may be used fo...

Claims

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Application Information

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IPC IPC(8): H01L23/12H01L23/36
CPCH01L2924/0002H01L23/3735H01L21/4871C04B37/026C04B2237/121C04B2237/128C04B2237/365C04B2237/366C04B2237/402C04B2237/407C04B2237/52C04B2237/704H01L2924/00B23K1/0016B23K1/19H05K3/20H05K2203/04
Inventor 石塚博弥
Owner MITSUBISHI MATERIALS CORP
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