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Copper alloy hot-rolled plate for sputtering target and sputtering target

A copper alloy and hot-rolled plate technology, which is applied in metal rolling, sputtering coating, metal material coating technology, etc., can solve the problem that the crystal grain size of Cu-α phase is easy to increase, and the crystal grain size is not considered. problem, achieve the effect of preventing the generation of particles and suppressing abnormal discharge

Active Publication Date: 2016-11-02
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] That is, according to the experiments of the present inventors, it is known that when the crystal grain size of the Cu-α phase in the Cu matrix in the Cu-Ca alloy constituting the sputtering target is large, abnormal discharge is likely to occur, but in Patent Document 1 In 2 and 2, the crystal grain size of the Cu-α phase in the Cu matrix is ​​not considered, and in the sputtering targets in Patent Documents 1 and 2, since the method of casting in a carbon mold is applied as a casting method, Cu -The crystal grain size of the α phase tends to increase, and this is considered to be one of the causes of abnormal discharge during sputtering

Method used

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  • Copper alloy hot-rolled plate for sputtering target and sputtering target
  • Copper alloy hot-rolled plate for sputtering target and sputtering target
  • Copper alloy hot-rolled plate for sputtering target and sputtering target

Examples

Experimental program
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Embodiment

[0074] use figure 1 The continuous casting device shown melts electrolytic copper with a purity of 99.99% by mass, and adds Ca to the molten copper through the addition mechanism 9, thereby casting No.1 to No.9 and No. 9 of the present invention examples in Table 1. A Cu—Ca-based alloy having the composition shown in No. 10 of the comparative example. The ingot was constituted as a cake-shaped ingot having a rectangular cross-section of 260 mm×640 mm. In addition, a carbon mold was used as a casting mold at the time of casting, and the amount of cooling water was set at 2,500 liters / minute. In addition, the tapered surface of the mold was set at 0.4° on the long side and 0.4° on the short side. The withdrawal speed was set at about 9 cm / min.

[0075] The casted continuous casting ingot was divided into lengths of 950 mm, heated in a batch heating furnace at the hot rolling starting temperature described in Table 1 for 2 hours, and then hot rolling was started, and the rolli...

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Abstract

Disclosed is a hot rolled plate produced by hot rolling an ingot cast by continuous casting, in which the plate is made of a copper alloy containing 0.5 to 10.0 at % of Ca and the balance consisting of Cu and inevitable impurities and the average grain size of Cu-α phase crystal grains is 5 to 60 μm in a Cu matrix.

Description

technical field [0001] The present invention relates to a method of forming, for example, a copper alloy film as a circuit film of a gate electrode, a source electrode, and a drain electrode of a thin film transistor on a material made of glass, amorphous Si, or silicon dioxide by sputtering. When being used as the sputtering target of the sputtering on the base plate, and the hot-rolled plate used in the sputtering target, it is particularly related to a Cu-Ca alloy (containing Copper alloy of Ca) sputtering target and hot-rolled plate. [0002] This application claims priority based on Patent Application No. 2012-288705 for which it applied in Japan on December 28, 2012, and uses the content here. Background technique [0003] As is well known, a flat panel display such as a liquid crystal display or an organic EL display has a structure in which a thin film transistor (hereinafter referred to as "TFT") is formed on a substrate such as glass. On the other hand, in recent...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00B21B3/00B22D11/00C22C9/01C22C9/05C23C14/34C22F1/00C22F1/08
CPCH01J37/3429B21B3/00B22D11/00C22C9/00C22C9/01C22C9/05C22F1/08C23C14/3414
Inventor 大久保清之小出正登
Owner MITSUBISHI MATERIALS CORP
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