Photoelasticity principle based flexile microprobe and application method thereof
A micro-probe and photoelastic technology, applied in the field of flexible micro-probes, can solve the problems of inconvenient operation and alignment, high cost, and achieve the effects of simple production, short production cycle and low processing cost.
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Embodiment 1~4
[0068] When the arc notch radius of the flexible hinge stress measurement area 2 is 140 μm, take the width of the flexible hinge measurement area as 50 μm, 60 μm, 70 μm, and 80 μm to measure the stress, and apply a force of 200 μN to the force-bearing end of the microprobe, and calculate Proportional coefficient к, the result is as follows:
[0069]
Embodiment 5~8
[0071] When the arc notch radius of the flexible hinge stress measurement area 2 is 180 μm, take the width of the flexible hinge measurement area as 50 μm, 60 μm, 70 μm, and 80 μm to measure the stress, and apply a force of 200 μN to the force-bearing end of the microprobe, and calculate Proportional coefficient к, the result is as follows:
[0072]
Embodiment 9~12
[0074] When the arc notch radius of the flexible hinge stress measurement area 2 is 220 μm, take the width of the flexible hinge measurement area as 50 μm, 60 μm, 70 μm, and 80 μm to measure the stress, and apply a force of 200 μN to the force-bearing end of the microprobe, and calculate Proportional coefficient к, the result is as follows:
[0075]
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