Nickel-chromium plating part and manufacturing method thereof
A manufacturing method and component technology, applied in the field of nickel-chromium plating components and its manufacture, can solve the problems that the corrosion resistance cannot be achieved, there is no mention of trivalent chromium electroplating, and the coating is prone to brittleness, etc.
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Embodiment 1
[0090] The nickel-chrome plated part of the present embodiment, this part comprises: base material 1 (ABS material); On the substrate 1, a bottoming nickel layer 808 is deposited on the chemical nickel layer 809, and a copper plating layer 3 is formed on the bottoming nickel layer 808; and a base layer 6, which is formed on the copper plating layer 3; and a functional layer 4 , which is formed on the base layer 6, wherein the functional layer 4 includes a low-potential nickel layer 141 and a microporous nickel layer 142, wherein the low-potential nickel layer 141 is a high-sulfur nickel layer, and the microporous nickel layer 142 is formed on the low-potential nickel layer 141 and a decoration layer 802, which is formed on the microporous nickel layer 142, wherein the decoration layer is a trivalent white chromium layer.
Embodiment 2
[0092] The nickel-plated part of the present embodiment, this part comprises: base material 1 (ABS material); Pretreatment plating layer 2 comprises chemical nickel layer 809, makes a bottom nickel layer 808 and copper plating layer 3, and chemical nickel layer 809 is deposited on the whole base material 1, a bottoming nickel layer 808 is deposited on the chemical nickel layer 809, and a copper plating layer 3 is formed on the bottoming nickel layer 808; and a base layer 6, which is formed on the copper plating layer 3; and a functional layer 4, which Formed on the base layer 6, wherein the functional layer 4 includes a low-potential nickel layer 141 and a microporous nickel layer 142, wherein the low-potential nickel layer 141 is a micro-cracked nickel layer, and the microporous nickel layer 142 is formed on the low-potential nickel layer 141; And a decoration layer 802, which is formed on the microporous nickel layer 142, wherein the decoration layer is a trivalent white chro...
Embodiment 3
[0094] The nickel-plated part of the present embodiment, this part comprises: base material 1 (ABS material); Base layer 2 comprises chemical nickel layer 809, make a nickel layer 808 and copper-plated layer 3, and chemical nickel layer 809 is deposited on whole base material 1 On, the base layer 808 of nickel is deposited on the chemical nickel layer 809, and the copper layer 3 is formed on the base layer 808; and the base layer 6 is formed on the copper layer 3; and the functional layer 4 is formed On the base layer 6, wherein the functional layer 4 includes a low-potential nickel layer 141 and a microporous nickel layer 142, wherein the low-potential nickel layer 141 is a high-sulfur nickel layer and a micro-crack nickel layer (which may be formed on a copper-plated layer of high-sulfur nickel On the layer 3, the microcrack nickel layer is formed on the high-sulfur nickel layer; it can also be that the microcrack nickel layer is formed on the copper plating layer 3, and the ...
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