Printed circuit board and method for manufacturing printed circuit board

Abstract

The invention provides a printed circuit board. The printed circuit board comprises a plurality of sub board bodies. The sub board bodies comprise the first sub board body and the second sub board body. A first medium layer is arranged between the first sub board body and the second sub board body. The first sub board body is located on the outmost side of the printed circuit board. The first surface of the first medium layer is in press fit with the pressing face of the first sub board body, and the second surface is in press fit with the second sub board body. The part, protruding out of the first surface, of a first guide connection column covers hole openings of via holes of the first sub board body. The part, protruding out of the second surface, of the first guide connection column covers hole openings of via holes of the second sub board body so that a conductive metal layer of the via holes of the first sub board body can be electrically connected with a conductive meal layer of the via holes of the second sub board body in a breakover mode through the first guide connection column. The invention provides a printed circuit board manufacturing method.

Description

technical field [0001] The invention relates to the field of electronic devices, in particular to a printed circuit board and a method for manufacturing the printed circuit board. Background technique [0002] With the development of science and technology, people have higher and higher requirements for the integration of integrated circuit boards. Ordinary single-sided crimping cannot meet the needs of system capacity. Double-sided crimping blind hole design is adopted, that is, two sub-boards are superimposed to form a mother board. Board structure, which can realize double-sided crimping and expand the capacity of the backplane. In addition, the demand for high-speed performance makes the density of the crimping connectors smaller and smaller, and the pitch of the crimping blind holes on the corresponding printed circuit board is getting smaller and smaller. [0003] In the prior art, when a printed circuit board is formed by laminating three or more sub-boards, and a bl...

AI Technical Summary

Problems solved by technology

[0004] However, with the above-mentioned processing, in order to avoid liquid medicine remaining in the holes, it is necessary to protect all other holes on the first sub-circuit board except the through hole C. The most commonly used method is to use an anti-corrosion layer to protect all other holes mentioned above hole, and then perform electroplating on the through hole, or process the circuit patterning on the surface of the printed circuit board. Make the other holes around the through hole C flow into the liquid medicine, thus affecting the electrical performance of the final printed circuit board

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