A self-locking silicon chip edge protection device

Abstract

The invention provides a silicon chip edge protection apparatus with a self-locking gripper. The apparatus comprises a servo motor, a speed reducing mechanism, a vertical motion mechanism and a gripper device, the gripper device comprises a downward cone cam and a push rod clinging to the cone cam, and the conical surface of the cone cam pushes a lever through the push rod in order to drive the gripper to close and shut in the vertical motion process of the gripper device. The silicon chip edge protection apparatus with a self-locking gripper has the advantages of simple structure, good manufacturability, easy processing manufacturing, good self-centering property, strong adaptability, self-locking function, and prevention of clamping deformation due to a protection ring.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing equipment, in particular to a silicon chip edge protection device used for a self-locking gripper of a photolithography machine. Background technique [0002] Silicon wafer edge protection device is in the field of integrated circuit manufacturing technology. In order to improve the production efficiency of silicon wafers, it is a device to protect the edge of silicon wafers while exposing and manufacturing silicon wafers in negative rubber process. It is to realize silicon wafer exposure and edge protection. The necessary device for simultaneous operation is installed inside the exposure equipment (lithography machine). It is necessary to have the function of quickly and accurately grasping the edge protection ring, and to complete a series of automatic work of placing the edge protection ring on the upper part of the silicon wafer, and grasping the edge protection ring t...

AI Technical Summary

Problems solved by technology

[0005] 1. The three-eccentric linkage cam mechanism mentioned in the two patents is a mechanism for realizing the grabbing function of the protective ring. Poor self-centering of claws

It is easy to cause the protection ring and the silicon wafer to be out of concentricity, which will cause the silicon wafer to be scrapped

[0006] 2. The cam end face of the triple eccentric linkage cam mechanism is positioned on the roller, and the friction is small. In case of sudden gas failure, due to the bias of the structure's own gravity, the cam may rotate on its own, causing the gripper to loosen and the protective ring to fall off and be damaged. Potential Risks of Wafers and Lithography Machine Worktables

[0007] 3. The gripper can only grab one type of protective ring, which has poor adaptability, and the gripper is rigidly clamped, which will easily cause deformation of the protective ring and reduce the quality of silicon wafers

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