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Phenyl vinyl silicon resin for adhering base as well as preparation method and application thereof

A technology based on phenylvinyl silicon and vinyl, applied in the direction of adhesives, etc., can solve the problems of light transmittance decrease, mechanical strength decrease, surface stickiness and other problems of LED packaging composition, and achieve good impurity ion content and adhesive strength The effect of improving the bonding strength

Inactive Publication Date: 2015-06-17
SHENZHEN CAPCHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, HCl, water glass, KOH and other substances are used in the synthesis process of silicone resin for LED packaging in China, and a large amount of Na, K, Cl and other elements that are harmful to the LED chip, or additional tackifiers are required, resulting in a decrease in the light transmittance of the LED packaging composition, and the surface is sticky after curing. The publication number is CN102690416A, and the name is "A High Refractive In the two patents whose publication number is CN103232601A and titled "Phenyl MDT Silicone Resin and Its Preparation Method", due to the use of raw materials such as water glass and HCl, and without any deionization treatment , which will lead to a large number of potentially harmful atoms in the product, the publication number is CN1993427A, the patent titled "curable organopolysiloxane composition, its curing method, semiconductor device and adhesion promoter" Among them, due to the additional use of tackifiers in LED packaging adhesives, this will lead to problems such as light transmittance and mechanical strength of LED adhesives decrease, and the surface is prone to stickiness after curing.
[0005] To sum up, the encapsulants in this field have insufficient bonding strength, so additional tackifiers need to be introduced, which brings about the technical problem of negative impact

Method used

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  • Phenyl vinyl silicon resin for adhering base as well as preparation method and application thereof
  • Phenyl vinyl silicon resin for adhering base as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0135] 3.3583g tetramethyldisiloxane (molecular weight 134.33), 6.7658g hexamethyldisiloxane (molecular weight 162.38), 13.98g divinyl tetramethyldisiloxane (molecular weight 186.4), 60g ethanol, 50g Deionized water and 3g of sulfuric acid were added to the reactor, and at 40°C, 128.7g of phenyltrimethoxysilane (molecular weight 198) was added dropwise to the reactor, and after the addition was completed, the temperature was raised to 80°C to continue the reaction for 6 hours; An equal volume of toluene was added to the finished mixed solution for extraction, and washed 5 times with deionized water until the pH value was close to neutral, and then anhydrous CaCl 2 Put it into the toluene solution of silicone resin to remove the moisture in the solution; add 5.5g of cation exchange resin Amberlyst15Dry to the toluene solution of the obtained silicone resin, react at 90°C for 8h, filter to remove the cation exchange resin, and then Remove the solvent and low boilers under reduce...

Embodiment 2

[0138] 2.6866g tetramethyldisiloxane (molecular weight 134.33), 9.4721g hexamethyldisiloxane (molecular weight 162.38), 5.592g divinyl tetramethyldisiloxane (molecular weight 186.4), 60g ethanol, 50g Deionized water and 20g of acetic acid were added to the reactor, and at 40°C, 108.9g of phenyltrimethoxysilane (molecular weight 198) was added dropwise to the reactor, and after the addition was completed, the temperature was raised to 50°C to continue the reaction for 8 hours; An equal volume of toluene was added to the finished mixed solution for extraction, and washed 4 times with deionized water until the pH value was close to neutral, and then anhydrous CaCl 2 Put it into the toluene solution of silicone resin to remove the moisture in the solution; add 5.5g phosphazene chloride to the toluene solution of the obtained silicone resin, react at 80°C for 1h, and then remove the solvent under reduced pressure at 170°C and low boilers to obtain a solid silicone resin containing ...

Embodiment 3

[0141] 4.0299g tetramethyldisiloxane (molecular weight 134.33), 12.9904g hexamethyldisiloxane (molecular weight 162.38), 12.42g dimethyldivinyldiphenyldisiloxane (molecular weight 310.54), 60g Add ethanol, 50g of deionized water, and 3g of trifluoromethanesulfonic acid into the reactor, and add 99g of phenyltrimethoxysilane (molecular weight: 198) dropwise to the reactor at 40°C, and raise the temperature to 70°C after the addition is completed The reaction was continued for 10 h; an equal volume of p-xylene was added to the mixed solution after the reaction for extraction, and deionized water was used to wash 3 times until the pH value was close to neutral, and then anhydrous CaCl 2 Put it into the toluene solution of silicone resin to remove the moisture in the solution; add 5.5HZSM-5 molecular sieve to the obtained p-xylene solution of silicone resin, react at 70°C for 6h, filter to remove the molecular sieve, and then in 170°C Remove the solvent and low boilers under reduc...

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Abstract

The invention discloses phenyl vinyl silicon resin for adhering a base as well as a preparation method and an application thereof. The phenyl vinyl silicon resin consists of solid silicon resin containing Si-H, methyl, phenyl and vinyl as well as an organic compound containing a tackifying radical and vinyl; under the effect of a hydrosilyation catalyst, the phenyl vinyl silicon resin is generated through a hydrosilyation reaction, wherein the tackifying radical is an organic radical capable of enhancing the adhesive capacity of the base. When the phenyl vinyl silicon resin provided by the invention is used as a reinforcing tackifying material in an LED, and can provide high hardness, high tenacity, high refractive index and higher lighting effect of LED packaging glue water; moreover, the phenyl vinyl silicon resin has good adhesive capacity for various bases, the material has excellent reliability in the using process, and the phenyl vinyl silicon resin has extremely high practicability.

Description

technical field [0001] The invention relates to the technical field of substrate encapsulation adhesives, in particular to the technical field of LED encapsulation adhesives, in particular to a phenyl vinyl silicone resin for substrate bonding with good adhesion to the substrate, a preparation method and application thereof. Background technique [0002] In recent years, LED (Light Emitting Diode, light-emitting diode), as a semiconductor light-emitting device, has been widely used in lighting, backlight, display and other fields due to its advantages of energy saving, long life, environmental protection, and high light efficiency. It is only 1 / 10 of the traditional light source. If the LED light source can be used instead of the traditional light source, it will greatly reduce the world's energy consumption rate. [0003] At present, polysiloxane has replaced traditional epoxy resin and has become the mainstream material for LED packaging. Polysiloxane has excellent propert...

Claims

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Application Information

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IPC IPC(8): C08G77/38C09J183/07C09J183/05C09J183/04
Inventor 赵大成马子淇
Owner SHENZHEN CAPCHEM TECH
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