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Preparing method of superhydrophobic concave angle T-shaped microcolumn structure

A super-hydrophobic, micro-pillar technology, applied in micro-structure technology, micro-structure devices, manufacturing micro-structure devices, etc., can solve the problems of difficult process, expensive equipment, poor controllability, etc., to achieve a wide process window and accelerated filling rate. , Improve the effect of corrosion resistance

Inactive Publication Date: 2015-05-27
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However for figure 1 (c) The preparation method of the structure shown in the prior art is very complicated, requiring repeated use of thermal silicon oxide coating, inductively coupled plasma etching, wet silicon etching, etc., and the equipment involved is very expensive. The cost is high, while the process is difficult and the controllability is poor, so it is urgent to develop a process method with low cost and high controllability

Method used

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  • Preparing method of superhydrophobic concave angle T-shaped microcolumn structure
  • Preparing method of superhydrophobic concave angle T-shaped microcolumn structure
  • Preparing method of superhydrophobic concave angle T-shaped microcolumn structure

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Effect test

Embodiment 1

[0046] The technical scheme of the present embodiment 1 can be specifically implemented through the following steps:

[0047] Step 1, photolithography

[0048] Spin-coat NR26-25000P negative photoresist on a clean substrate with a thickness of 20 μm; use a mask with a circular array pattern, the circular area is opaque, the diameter of the circle is 10 μm, and the spacing is 30 μm; use MA6 contact photoresist engraving machine.

[0049] Step 2, developing

[0050] Put the substrate after step 1 into RD6 developing solution for development, and obtain the first circular hole array structure of photoresist on the substrate.

[0051] Step 3, Magnetron Sputtering

[0052] The substrate with the photoresist circular hole array structure after development in the second step is deposited with the magnetron sputtering method to sequentially deposit the adhesion layer Ti and the seed layer Cu, and the thickness of Ti / Cu is 10nm / 50nm.

[0053] Step 4, photolithography

[0054] Spin...

Embodiment 2

[0066] The technical scheme of present embodiment 2 can be specifically implemented through the following steps:

[0067] Step 1, photolithography

[0068] Spin-coat NR26-25000P negative photoresist on a clean substrate with a thickness of 20 μm; use a mask with a circular array pattern, the circular area is transparent, the diameter of the circle is 10 μm, and the spacing is 100 μm; use MA6 contact photolithography machine.

[0069] Step 2, developing

[0070] Put the substrate after step 1 into RD6 developing solution for development, and obtain the first circular hole array structure of photoresist on the substrate.

[0071] Step 3, Magnetron Sputtering

[0072] The substrate with the photoresist circular hole array structure after development in the second step is deposited with an adhesion layer Ti and a seed layer Cu in sequence by magnetron sputtering, and the thickness of Ti / Cu is 10 / 50nm.

[0073] Step 4, photolithography

[0074] Spin-coat PR1-1000A positive pho...

Embodiment 3

[0088] The technical scheme of present embodiment 3 can be specifically implemented through the following steps:

[0089] Step 1, photolithography

[0090] Spin-coat NR26-25000P negative photoresist on a clean substrate with a thickness of 60 μm; use a mask with a circular array pattern, the circular area is transparent, the diameter of the circle is 20 μm, and the spacing is 120 μm; use MA6 contact photolithography machine.

[0091] Step 2, developing

[0092] Put the substrate after step 1 into RD6 developing solution for development, and obtain the first circular hole array structure of photoresist on the substrate.

[0093] Step 3, Magnetron Sputtering

[0094] On the substrate with the photoresist circular hole array structure developed in the second step, the adhesion layer Ti and the seed layer Cu are sequentially deposited by magnetron sputtering, and the thickness of Ti / Cu is 50 / 100nm.

[0095] Step 4, photolithography

[0096]Spin-coat PR1-4000A positive photore...

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Abstract

The invention discloses a preparing method of a superhydrophobic concave angle T-shaped microcolumn structure. The method comprises the steps of (a), rotationally coating photoresist on one surface of a chip and executing developing operation to obtain a first round hole array; (b), depositing an adhesion layer and a seed layer on the surface of the photoresist in sequence; (c) rotationally coating the photoresist on the surface of the seed layer and executing the developing operation to obtain a second round hole array; (d), performing plating and filling on the first round hole array and the second round hole array to obtain a metal T-shaped microcolumn structure; (e) removing the photoresist and surplus adhesion layer and seed layer; (f), depositing a protection layer on the surface of the T-shaped microcolumn; (g), removing a lateral extending part of the microcolumn T-shaped structure and remaining a columnar structure and the protection layer to obtain one concave angle T-shaped microcolumn structure. According to the method, a target structure of different sizes can be prepared controllably, a process window is wide, the repeatability is good, the chemical stability is high, and the superhydrophobic concave angle T-shaped microcolumn structure has excellent superhydrophobic performance and self-cleaning capacity.

Description

technical field [0001] The invention belongs to the field of micro-nano manufacturing, and more specifically relates to a method for preparing a super-hydrophobic concave-angle T-shaped micro-column structure. Background technique [0002] Superhydrophobic surface (the apparent contact angle of water droplets on the surface is greater than 150°, and the contact angle hysteresis is less than 10°) due to its unique anti-moisture, low adhesion and self-cleaning properties, in microfluidic systems, non-destructive liquid transport, micro Nano-electromechanical systems have great application prospects in the field of low-adhesion functional surfaces and biocompatibility. At present, superhydrophobic surfaces are generally obtained by processing microscopic rough structures on the surface of materials and coating hydrophobic materials. On a rough surface, the contact state between the droplet and the rough structure determines the wettability of the surface. When the droplet is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/04B81C1/00
Inventor 廖广兰独莉史铁林谭先华陈鹏飞
Owner HUAZHONG UNIV OF SCI & TECH
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