Surface enhanced Raman scattering substrate and manufacturing method thereof

A surface-enhanced Raman and substrate technology, applied in Raman scattering, material excitation analysis, etc., can solve the problem that it is difficult to obtain the SERS surface substrate with precise control of the arraying degree, and meet the requirements of saving raw materials and energy, and surface properties Effect of low, large substrate size

Active Publication Date: 2015-04-29
SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to limiting factors such as substrate surface properties, processing difficulty, processing environmental conditions, and production costs, it is still difficult to obtain SERS surface substrates with precisely controlled nanostructure morphology, size, and arraying degree.

Method used

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  • Surface enhanced Raman scattering substrate and manufacturing method thereof
  • Surface enhanced Raman scattering substrate and manufacturing method thereof
  • Surface enhanced Raman scattering substrate and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] In this embodiment, the VX500 3D printer of German Voxeljet Company is used as the processing equipment. The metal nanounit array pattern on the surface of the SERS substrate is designed on the computer of the 3D printer control system. Put the substrate into the 3D printer workbench, lay a layer of Au powder with a particle size of 1nm on the substrate, and the thickness of the Au powder layer is 400nm; according to the set array pattern, the nozzle of the 3D printer is directed on the preset pattern. Add the matching adhesive of Voxeljet to the Au powder layer, and use the laser equipment attached to the 3D printer to sinter the Au powder particles adhered to the adhesive. The laser power is 200W, the sintering temperature is 1000°C, and the time is 60 seconds; the sintering is completed After that, use N 2 The gas blows off the unbonded and fixed Au powder particles to form an array of Au nanounits on the substrate, wherein the spacing of the Au nanounits is 1 μm. ...

Embodiment 2

[0034] This embodiment uses the Objet350Connex type 3D printer of Stratasys Company of the United States as the processing equipment. The metal nanounit array pattern on the surface of the SERS substrate is designed on the computer of the 3D printer control system. Put the substrate into the 3D printer workbench, lay an Ag powder layer with a particle size of 5nm on the substrate, and the thickness of the Ag powder layer is 500nm; according to the set array pattern, use the 3D printer nozzle in the direction of the preset pattern The Ag powder layer is dripped with an organic adhesive. Wherein, in terms of mass percentage, the organic adhesive contains 65% methacrylate, 22% ethylene and propylene mixture, 12% ethylene oxide, 0.8% peroxide initiator, 0.2% copper acetylacetonate ; and use the printer's UV device to quickly cure the adhesive, and then use N 2 The gas blows off the unbonded and fixed Ag powder particles, forming an Ag nanounit array structure on the substrate, w...

Embodiment 3

[0037]This embodiment uses the Objet350Connex type 3D printer of Stratasys Company of the United States as the processing equipment. The metal nanounit array pattern on the surface of the SERS substrate is designed on the computer of the 3D printer control system. Put the substrate into the 3D printer workbench, and lay a Cu powder layer with a particle size of 10nm on the substrate. The Cu powder layer is dripped with an inorganic adhesive. Wherein, in terms of mass percentage, the inorganic adhesive contains 4% sodium chloride, 6% sodium carbonate, 3% sodium bicarbonate, 7% silicic acid, 25% xylitol, and 55% water; and Use the printer's UV unit to cure the adhesive quickly, and then use the N 2 The gas blows off unbonded and fixed Cu powder particles to form a structure of Cu nanounit array on the substrate, wherein the spacing of Cu nanounits is 2 μm. Put the above-obtained Cu nano unit array substrate into a high temperature furnace at 500° C. for sintering and annealin...

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Abstract

The invention discloses a surface enhanced Raman scattering substrate. The surface enhanced Raman scattering substrate comprises a base and a metal nano unit array arranged on the base, wherein each metal nano unit is formed by fixedly adhering metal powder particles by an adhesive; the adhesive is an inorganic adhesive or an organic adhesive; and the height of each metal nano unit is 400nm-800nm and the distance between the two adjacent metal nano units is 1-2 microns. The invention further provides a manufacturing method of the substrate; the metal powder particles are adhered through 3D printing equipment by using the adhesive to form a metal nano unit array structure on the base; and the surface enhanced Raman scattering substrate is obtained by adopting sintering and annealing processes. The surface enhanced Raman scattering substrate disclosed by the invention has a stable structure and the high surface activity; the adhering method is simple and the manufacturing cost is reduced; and the shape and the position of the nano array structure are easy to control and the repetitive rate is high.

Description

technical field [0001] The invention relates to the technical field of surface-enhanced Raman scattering chips, in particular to a surface-enhanced Raman scattering substrate and a preparation method thereof. Background technique [0002] In the 1970s, it was found that the Raman scattering signal of several molecular layers of pyridine adsorbed on the roughened surface of the silver electrode was 10 times that of the normal Raman spectrum. 5 ~10 6 times, and named this phenomenon Surface Enhanced Raman Scattering (Surface Enhanced Raman Scattering), referred to as SERS. Due to the high surface sensitivity of SERS, it has been widely used in chemical detection and biological analysis. [0003] However, the radiation intensity of Raman scattering is proportional to the number of irradiated molecules, and usually only a very small number of photons in the incident light will undergo Raman scattering, which makes the scattering signal very weak and makes it difficult to detec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/65
Inventor 潘革波刘文广肖燕刘永强吴浩迪
Owner SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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