Multi-branch distribution heat pipe and manufacturing method thereof

Abstract

The invention discloses a multi-branch distribution heat pipe. The multi-branch distribution heat pipe comprises a multi-channel pipe joint, a first pipe casing, a second pipe casing and a third pipe casing, wherein one end of the first pipe casing, one end of the second pipe casing and one end of the third pipe casing are sealed; the multi-channel pipe joint is provided with connecting openings, wherein every connecting opening is used for connecting with the corresponding pipe casing; an empty sealing chamber which is communicated with the connecting openings is formed in the multi-channel pipe joint; the other end of every pipe casing is in insertion joint with the corresponding connecting opening of the multi-channel pipe joint to form a T-shaped structure, wherein the T-shaped structures are communicated with each other; the inner wall of every pipe casing is provided with a layered porous capillary layer; the inner sealing chamber of the multi-channel pipe joint is filled with capillary layer connectors which are used for maintaining the communication of the pipe casings. The invention also provides a manufacturing method of the multi-branch distribution heat pipe. According to the multi-branch distribution heat pipe and the manufacturing method thereof, the spatial hierarchical porous capillary layers and the sintering heat pipe are high in capillary force and heat transfer capability and accordingly the radial thermal resistance can be obviously improved; meanwhile the space required by heat dissipation is saved and accordingly a flexible, reliable and stable heat dissipation environment can be provided for the miniaturization development of electronic equipment; the cost is low and accordingly the multi-branch distribution heat pipe is suitable for industrialized production.

Description

technical field [0001] The invention relates to heat dissipation components in the electronic field, in particular to a multi-branch distributed heat pipe and a manufacturing method thereof. Background technique [0002] The development of modern science and technology is inseparable from the support of various types of electronic equipment. These electronic equipment have developed rapidly in the fields of aerospace, military equipment, and commercial equipment. Since the beginning of the new century, electronic equipment has gradually developed towards the direction of miniaturization, integration and high power. The more difficult it is to transfer the heat out quickly, the service life, reliability, and stability are continuously reduced, which is in strong contradiction with the direction of its development. For this reason, electronic equipment continuously puts forward stricter requirements on heat dissipation design, and requires a thermal design solution suitable f...

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Problems solved by technology

[0005] The primary purpose of the present invention is to propose a multi-branch distributed heat pipe with high capillary pressure, high heat transfer performance and high heat transfer performance and its manufacturing method for the single structure and insufficient heat dissipation capacity of traditional heat pipes, so as to solve the problem of Solved the problems of insufficient heat dissipation capacity of existing heat pipes and excessive heat dissipation space

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