Structure of heat sink and manufacturing method
A technology of heat dissipation device and manufacturing method, which is applied in the direction of cooling/ventilation/heating transformation, indirect heat exchanger, lighting and heating equipment, etc. It can solve the problem of increased material cost, capillary force is not as good as sintering, and troubles manufacturing developers and users, etc. question
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[0028] Please refer to Figure 4 , the heat dissipating device of the present invention can be realized by a heat uniform chamber (vapor chamber). The heat dissipation device includes a cavity 30 and a capillary structure 40 formed inside the cavity 30 . The capillary structure 40 also includes a porous powder 41 (sintered powder) sintered on the inner wall of the cavity 30 at high temperature, and a plurality of grooves 42 formed on the inner wall of the cavity 30 . With the help of the above structure, the cooling device has both the better capillary force of the sintered capillary structure and the better permeability of the grooved capillary structure. Perfectly protect the heat-generating components it is connected to (for example: CPU).
[0029] Here, it must be added that the cooling device is additionally filled with a working fluid (such as inorganic compounds, water, alcohols, liquid metals, ketones, refrigerants, or organic compounds), and the working fluid can be...
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