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Semi-flexible circuit board and its preparation method

A semi-flexible, circuit board technology, used in multi-layer circuit manufacturing, printed circuit manufacturing, printed circuits, etc., can solve the problem of easy overflow of glue in semi-flexible areas, achieve good toughness, ensure interlayer adhesion, reduce The effect of the degree of overflow

Active Publication Date: 2018-01-30
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Based on this, the purpose of the present invention is to overcome the defect that the semi-flexible area of ​​the semi-flexible circuit board is easy to overflow the glue in the prior art, and to provide a preparation method of the semi-flexible circuit board. Using this method, the semi-flexible circuit board can be well controlled. The degree of glue overflow in the flexible area, control it within the acceptable range

Method used

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  • Semi-flexible circuit board and its preparation method
  • Semi-flexible circuit board and its preparation method

Examples

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Embodiment

[0041] A semi-flexible circuit board with a total of 6 layers, of which the L5-6 layer is a semi-flexible layer, and the remaining layers are rigid layers. The structure is as follows figure 1 shown. The preparation method of this circuit board is as follows:

[0042] 1. Rigid sub-board production.

[0043] (1) The inner layer circuit of the rigid core board: through the method of film or laser imaging and acid etching figure 2 On the rigid core board shown, the inner layer circuit patterns of the designed inner layers L2, L3, and L4 are transferred and produced, as shown in image 3 shown.

[0044] (2) Lamination of rigid sub-boards: The above two rigid core boards are pressed together with a flowable prepreg to form a L1-4 rigid sub-board. ) needs to be pressed with prepreg and temporary copper foil.

[0045] Among them: the thickness of the prepreg after lamination is reduced by 50-100 μm for the thickness of the medium between the circuit layer and the semi-flexible ...

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Abstract

The invention belongs to the technical field of printed circuit boards and discloses a semi-flexible circuit board and a preparation method thereof. The preparation method includes manufacturing of a rigid auxiliary board, manufacturing of a semi-flexible core board, laminating of a main board, manufacturing of an outer layer of the main board and a windowing procedure. Manufacturing of the rigid auxiliary board includes: (1) manufacturing an inner-layer circuit of a rigid core board; (2) adopting a flowing type prepreg for laminating the rigid core board to make the rigid auxiliary board, and pressing the prepreg and temporary copper foils onto a surface, adjacent to the semi-flexible core board, of the inner-layer circuit; (3) removing the temporary copper foils by etching; (4) milling grooves. In the procedure of laminating of the main board, the rigid auxiliary board and the semi-flexible core board are laminated by the aid of a non-flow type prepreg. Therefore, a dielectric layer between the rigid auxiliary board and the semi-flexible core board is made by means of twice lamination, interlayer binding force between the rigid auxiliary board and the semi-flexible core board is guaranteed while glue overflowing in a semi-flexible area is reduced, and the problem of proneness to glue overflowing in the prior art is solved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a semi-flexible circuit board and a preparation method thereof. Background technique [0002] With the development of electronic products in the direction of miniaturization and portability, the printed circuit board (PCB) required by them is also developing in the direction of lightness, thinness, shortness and smallness. [0003] Rigid-flex printed circuit boards use a special process to connect rigid boards through flexible boards to achieve three-dimensional assembly, which is in line with the development trend of the PCB industry. In recent years, the rigid-flex circuit board market needs to grow at an annual growth rate of more than 10%. The growth of the market has led to more resources in the industry being invested in the production of rigid-flex boards, which has brought about greater competition in the industry. Behind the high profit of the rigid-flex...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K1/14
CPCH05K1/147H05K3/361H05K3/4611
Inventor 林楚涛莫欣满陈蓓
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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