Semiconductor packaging structure and heat dissipation member thereof

A technology of packaging structure and heat dissipation parts, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc. It can solve the problem of glue overflow in the central upper tip hole 421, uneven pressure in the mold, poor glue filling efficiency, etc. problems, to achieve the effect of suppressing glue overflow and avoiding glue overflow problems

Active Publication Date: 2014-02-19
SILICONWARE PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] However, in the existing manufacturing method of the semiconductor package structure 4, the glue filling efficiency is not good by means of side glue filling, and because of the design of the center upper sharp hole 421, the pressure in the mold is not uniform, and it is easy to be in the center. The problem of glue overflow at the upper tip hole 421

Method used

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  • Semiconductor packaging structure and heat dissipation member thereof
  • Semiconductor packaging structure and heat dissipation member thereof
  • Semiconductor packaging structure and heat dissipation member thereof

Examples

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Embodiment Construction

[0080] The implementation of the present invention will be described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0081] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "upper", "lower", "f...

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Abstract

Provided are a semiconductor packaging structure and a heat dissipation member thereof. The semiconductor packaging structure comprises a bearing member having a semiconductor assembly and a heat dissipation member so that an accommodation space is formed between the heat dissipation member and the bearing member to make the semiconductor assembly positioned in the accommodation space. The heat dissipation member has a guide channel which is provided with a through hole and a recessed structure. The though hole is communicated with the accommodation space. The recesses structure is connected with a hole wall of the through hole, such that if a packaging rubber body is formed in the accommodation space and the recessed structure to wrap the semiconductor assembly, excessive glue is prevented from flowing around the through hole, and the heat dissipation efficiency can be improved.

Description

technical field [0001] The invention relates to a semiconductor package structure, in particular to a semiconductor package structure with a heat sink and the heat sink. Background technique [0002] In the heat dissipation technology of the current semiconductor packaging structure, heat sinks are often arranged outside the structure, so that the heat sink can be used as a heat dissipation path by contacting the heat sink with air, such as figure 1 The semiconductor packaging structure 1 shown has a packaging substrate 10, a semiconductor component 11 disposed on the packaging substrate 10, a heat sink 12 disposed on the packaging substrate 10 to cover the semiconductor component 11, and covering the semiconductor component 11. The encapsulant 13 on the sides of the semiconductor component 11 and the heat sink 12 . Wherein, the heat sink 12 has a central through hole 120 , so that the encapsulant 13 can be filled into the inner side of the heat sink 12 through the central ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367
CPCH01L2224/48091H01L2224/48227H01L2224/73265H01L2924/15311H01L2924/00014
Inventor 赖清文陈建志赖裕庭黄承文
Owner SILICONWARE PRECISION IND CO LTD
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